Inventor · disambiguated record
Kyoka Susuki
Also filed as: SUSUKI Kyoka
2 granted patents·3 pending applications·0 citations·filing 2018–2022
22Inventor score
Files withMITSUBISHI MATERIALS CORP5
Top patents by PatentIndex Score
5 records- 0161US2024117119A1Polyimide resin composition and metal base substrateMITSUBISHI MATERIALS CORP·Filed 2022·Application pending·0 cites
- 0252US2023027568A1Method of producing copper oxide powder, and copper oxide powderMITSUBISHI MATERIALS CORP·Filed 2020·Application pending·0 cites
- 0342US2023038219A1Tin or tin alloy electroplating solution, method for forming bumps, and method for producing circuit boardMITSUBISHI MATERIALS CORP·Filed 2021·Application pending·0 cites
- 0436US11268203B2Tin or tin alloy plating solutionMITSUBISHI MATERIALS CORP·Filed 2018·Granted Mar 8, 2022·0 cites·8 claims
- 0534US11162182B2Tin or tin alloy plating solutionMITSUBISHI MATERIALS CORP·Filed 2018·Granted Nov 2, 2021·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →