Inventor · disambiguated record
Mami Watanabe
Also filed as: WATANABE MAMI
7 granted patents·3 pending applications·0 citations·filing 2011–2021
67Inventor score
Top patents by PatentIndex Score
10 records- 0154US9783904B2High-purity electrolytic copper and electrolytic refining method thereofMITSUBISHI MATERIALS CORP·Filed 2013·Granted Oct 10, 2017·0 cites·2 claims
- 0252US2023027568A1Method of producing copper oxide powder, and copper oxide powderMITSUBISHI MATERIALS CORP·Filed 2020·Application pending·0 cites
- 0350US11174565B2Plating liquidMITSUBISHI MATERIALS CORP·Filed 2018·Granted Nov 16, 2021·0 cites·16 claims
- 0449US10329680B2Plating solution using sulfonium saltMITSUBISHI MATERIALS CORP·Filed 2016·Granted Jun 25, 2019·0 cites·4 claims
- 0549US10174434B2Plating solution using phosphonium saltMITSUBISHI MATERIALS CORP·Filed 2016·Granted Jan 8, 2019·0 cites·4 claims
- 0642US2023038219A1Tin or tin alloy electroplating solution, method for forming bumps, and method for producing circuit boardMITSUBISHI MATERIALS CORP·Filed 2021·Application pending·0 cites
- 0741US10450665B2Plating solution using ammonium saltMITSUBISHI MATERIALS CORP·Filed 2016·Granted Oct 22, 2019·0 cites·10 claims
- 0841US2013075272A1Highly pure copper anode for electrolytic copper plating, method for manufacturing same, and electrolytic copper plating methodNAKAYA KIYOTAKA·Filed 2011·Application pending·0 cites
- 0936US11268203B2Tin or tin alloy plating solutionMITSUBISHI MATERIALS CORP·Filed 2018·Granted Mar 8, 2022·0 cites·8 claims
- 1034US11162182B2Tin or tin alloy plating solutionMITSUBISHI MATERIALS CORP·Filed 2018·Granted Nov 2, 2021·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →