Inventor · disambiguated record
Jia Yi Wong
Also filed as: WONG JIA YI
6 granted patents·3 pending applications·22 citations·filing 2012–2024
72Inventor score
Files withINFINEON TECHNOLOGIES AG5INFINEON TECHNOLOGIES AUSTRIA AG2INFINEON TECHNLOLGIES AG1SUNPOWER CORP1
Top patents by PatentIndex Score
9 records- 0189US8877617B2Methods and structures for forming and protecting thin films on substratesSUNPOWER CORP·Filed 2012·Granted Nov 4, 2014·20 cites·20 claims
- 0267US2023411336A1Semiconductor wafer, clip and semiconductor deviceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Application pending·0 cites
- 0366US10727151B2Semiconductor chip package having a cooling surface and method of manufacturing a semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jul 28, 2020·2 cites·13 claims
- 0460US11756917B2Method for processing a semiconductor wafer, semiconductor wafer, clip and semiconductor deviceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2021·Granted Sep 12, 2023·0 cites·16 claims
- 0555US2024363502A1Semiconductor deviceINFINEON TECHNLOLGIES AG·Filed 2024·Application pending·0 cites
- 0644US11217529B2Semiconductor device and method of forming a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jan 4, 2022·0 cites·30 claims
- 0738US2021043549A1Clips for semiconductor packagesINFINEON TECHNOLOGIES AG·Filed 2019·Application pending·0 cites
- 0835US11107754B2Electronic device, leadframe for an electronic device and method for fabricating an electronic device and a leadframeINFINEON TECHNOLOGIES AG·Filed 2018·Granted Aug 31, 2021·0 cites·17 claims
- 0935US10431526B2Rivetless lead fastening for a semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2017·Granted Oct 1, 2019·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →