Inventor · disambiguated record
Aizou Kaneda
Also filed as: KANEDA AIZOU
14 granted patents·304 citations·filing 1995–2008
93Inventor score
Files withHITACHI CHEMICAL CO LTD14
Top patents by PatentIndex Score
14 records- 0191US6223429B1Method of production of semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 1996·Granted May 1, 2001·145 cites·3 claims
- 0286US7061081B2Resin composition, heat-resistant resin paste and semiconductor device using them and method for manufacture thereofHITACHI CHEMICAL CO LTD·Filed 2001·Granted Jun 13, 2006·24 cites·24 claims
- 0378US6099678ALaminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 1995·Granted Aug 8, 2000·61 cites·36 claims
- 0469US6825249B1Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2000·Granted Nov 30, 2004·17 cites·16 claims
- 0567US7387914B2Semiconductor device and process for fabrication thereofHITACHI CHEMICAL CO LTD·Filed 2006·Granted Jun 17, 2008·2 cites·14 claims
- 0666US6717242B2Semiconductor device and process for fabrication thereofHITACHI CHEMICAL CO LTD·Filed 2001·Granted Apr 6, 2004·12 cites·6 claims
- 0764US7560307B2Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the sameHITACHI CHEMICAL CO LTD·Filed 2006·Granted Jul 14, 2009·1 cites·6 claims
- 0860US6855579B2Semiconductor device and process for fabrication thereofHITACHI CHEMICAL CO LTD·Filed 2001·Granted Feb 15, 2005·6 cites·14 claims
- 0954US7781896B2Semiconductor device and process for fabrication thereofHITACHI CHEMICAL CO LTD·Filed 2008·Granted Aug 24, 2010·0 cites·3 claims
- 1054US6404068B1Paste composition, and protective film and semiconductor device both obtained with the sameHITACHI CHEMICAL CO LTD·Filed 1999·Granted Jun 11, 2002·21 cites·19 claims
- 1153US7057265B2Semiconductor device and process for fabrication thereofHITACHI CHEMICAL CO LTD·Filed 2003·Granted Jun 6, 2006·3 cites·13 claims
- 1250US7078094B2Semiconductor device and process for fabrication thereofHITACHI CHEMICAL CO LTD·Filed 2004·Granted Jul 18, 2006·2 cites·27 claims
- 1347US7012320B2Semiconductor device and process for fabrication thereofHITACHI CHEMICAL CO LTD·Filed 2001·Granted Mar 14, 2006·2 cites·42 claims
- 1438US6611064B1Semiconductor device and method for manufacturing the sameHITACHI CHEMICAL CO LTD·Filed 1999·Granted Aug 26, 2003·8 cites·3 claims
Join the waitlist — get patent alerts
Get an alert when Aizou Kaneda files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →