Inventor · disambiguated record
David Ross Economy
Also filed as: ECONOMY DAVID R · Economy David Ross
24 granted patents·4 pending applications·28 citations·filing 2017–2025
93Inventor score
Top patents by PatentIndex Score
28 records- 0194US11456208B2Methods of forming apparatuses including air gaps between conductive lines and related apparatuses, memory devices, and electronic systemsMICRON TECHNOLOGY INC·Filed 2020·Granted Sep 27, 2022·5 cites·31 claims
- 0293US11705500B2Assemblies having conductive structures with three or more different materialsMICRON TECHNOLOGY INC·Filed 2021·Granted Jul 18, 2023·2 cites·16 claims
- 0392US10847367B2Methods of forming tungsten structuresMICRON TECHNOLOGY INC·Filed 2018·Granted Nov 24, 2020·7 cites·26 claims
- 0491US11646206B2Methods of forming tungsten structuresMICRON TECHNOLOGY INC·Filed 2020·Granted May 9, 2023·2 cites·20 claims
- 0587US10957775B2Assemblies having conductive structures with three or more different materialsMICRON TECHNOLOGY INC·Filed 2019·Granted Mar 23, 2021·3 cites·33 claims
- 0684US9773807B1Conductive components and memory assembliesMICRON TECHNOLOGY INC·Filed 2017·Granted Sep 26, 2017·4 cites·26 claims
- 0783US12431407B2Memory device with low density thermal barrierMICRON TECHNOLOGY INC·Filed 2024·Granted Sep 30, 2025·0 cites·18 claims
- 0877US2025279142A1Memory Arrays Comprising Strings of Memory Cells and Methods Used in Forming a Memory Array Comprising Strings of Memory CellsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0976US11990528B2Assemblies having conductive structures with three or more different materialsLODESTAR LICENSING GROUP LLC·Filed 2022·Granted May 21, 2024·0 cites·16 claims
- 1075US11349068B2Memory cellsINTEL CORP·Filed 2019·Granted May 31, 2022·2 cites·18 claims
- 1174US11189662B2Memory cell stack and via formation for a memory deviceMICRON TECHNOLOGY INC·Filed 2020·Granted Nov 30, 2021·1 cites·13 claims
- 1274US11158561B2Memory device with low density thermal barrierMICRON TECHNOLOGY INC·Filed 2019·Granted Oct 26, 2021·1 cites·11 claims
- 1370US12322443B2Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cellsMICRON TECHNOLOGY INC·Filed 2022·Granted Jun 3, 2025·0 cites·41 claims
- 1470US11984382B2Memory device with low density thermal barrierMICRON TECHNOLOGY INC·Filed 2021·Granted May 14, 2024·0 cites·20 claims
- 1569US12087358B2Access line grain modulation in a memory deviceMICRON TECHNOLOGY INC·Filed 2021·Granted Sep 10, 2024·0 cites·20 claims
- 1668US10916564B2Assemblies having vertically-extending structures, and methods of forming assemblies having vertically-extending channel material pillarsMICRON TECHNOLOGY INC·Filed 2020·Granted Feb 9, 2021·0 cites·19 claims
- 1768US10014319B1Conductive components and memory assembliesMICRON TECHNOLOGY INC·Filed 2017·Granted Jul 3, 2018·1 cites·23 claims
- 1866US11721606B2Memory device with high resistivity thermal barrierMICRON TECHNOLOGY INC·Filed 2021·Granted Aug 8, 2023·0 cites·20 claims
- 1964US12022666B2Memory cell stack and via formation for a memory deviceMICRON TECHNOLOGY INC·Filed 2021·Granted Jun 25, 2024·0 cites·20 claims
- 2064US10700091B2Assemblies having vertically-extending structures, and methods of forming assemblies having vertically-extending channel material pillarsMICRON TECHNOLOGY INC·Filed 2019·Granted Jun 30, 2020·0 cites·8 claims
- 2159US10355014B1Assemblies having vertically-extending structuresMICRON TECHNOLOGY INC·Filed 2017·Granted Jul 16, 2019·0 cites·11 claims
- 2258US10964621B2Memory device with high resistivity thermal barrierMICRON TECHNOLOGY INC·Filed 2019·Granted Mar 30, 2021·0 cites·11 claims
- 2355US10475810B2Conductive components and memory assembliesMICRON TECHNOLOGY INC·Filed 2018·Granted Nov 12, 2019·0 cites·27 claims
- 2453US2023209810A1Bit lines having high electrical conductivity and low mutual capacitance and related apparatuses, computing systems, and methodsMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 2552US2023207458A1Bit lines having high electrical conductivity and low mutual capacitance and related apparatuses, computing systems, and methodsMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 2652US2023397423A1Methods of forming microelectronic devices, and related microelectronic devices, memory devices, and electronic systemsMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 2748US10991425B2Access line grain modulation in a memory deviceMICRON TECHNOLOGY INC·Filed 2018·Granted Apr 27, 2021·0 cites·21 claims
- 2842US11018298B2Phase change memory structuresINTEL CORP·Filed 2017·Granted May 25, 2021·0 cites·25 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →