Inventor · disambiguated record
Chin-Li Kao
Also filed as: KAO CHIN-LI
25 granted patents·8 pending applications·105 citations·filing 2005–2025
94Inventor score
Files withADVANCED SEMICONDUCTOR ENG33
Top patents by PatentIndex Score
33 records- 0195US11127650B2Semiconductor device package including thermal dissipation element and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Sep 21, 2021·8 cites·19 claims
- 0295US10134677B1Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Nov 20, 2018·20 cites·18 claims
- 0393US9773753B1Semiconductor devices and methods of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Sep 26, 2017·30 cites·24 claims
- 0490US9478500B2Interposer substrate, semiconductor structure and fabricating process thereofADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted Oct 25, 2016·10 cites·24 claims
- 0589US10332862B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Jun 25, 2019·6 cites·30 claims
- 0689US10037974B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Jul 31, 2018·10 cites·19 claims
- 0780US9589840B2Semiconductor package and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Mar 7, 2017·4 cites·18 claims
- 0879US11309253B2Package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Apr 19, 2022·1 cites·24 claims
- 0977US11621217B2Substrate structure and semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Apr 4, 2023·1 cites·17 claims
- 1076US9891048B2Measurement equipmentADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Feb 13, 2018·4 cites·23 claims
- 1175US11011444B2Semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted May 18, 2021·1 cites·17 claims
- 1275US9917043B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Mar 13, 2018·2 cites·17 claims
- 1372US2025183104A1Semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2025·Application pending·0 cites
- 1471US7482204B2Chip packaging processADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Jan 27, 2009·4 cites·8 claims
- 1570US11244909B2Package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Feb 8, 2022·1 cites·15 claims
- 1664US2021272866A1Semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2021·Application pending·0 cites
- 1763US9589871B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted Mar 7, 2017·1 cites·14 claims
- 1862US7335982B2Chip package structure and chip packaging processADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Feb 26, 2008·2 cites·13 claims
- 1958US12494446B2Package structures and methods of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Dec 9, 2025·0 cites·19 claims
- 2058US10840219B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Nov 17, 2020·0 cites·19 claims
- 2155US10222209B2Measurement equipmentADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Mar 5, 2019·0 cites·23 claims
- 2253US12113044B2Semiconductor package and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Oct 8, 2024·0 cites·20 claims
- 2353US10541198B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Jan 21, 2020·0 cites·18 claims
- 2453US2025038078A1Bonding structure and package structureADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 2552US10056325B2Semiconductor package having a trench penetrating a main bodyADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Aug 21, 2018·0 cites·18 claims
- 2652US2024413115A1Package structureADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 2751US2024334586A1Package structureADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 2851US2024304450A1Electronic package structureADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 2950US11855034B2Electronic device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Dec 26, 2023·0 cites·13 claims
- 3050US11430761B2Semiconductor package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Aug 30, 2022·0 cites·19 claims
- 3150US11257776B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Feb 22, 2022·0 cites·20 claims
- 3248US2025260153A1Electronic deviceADVANCED SEMICONDUCTOR ENG·Filed 2024·Application pending·0 cites
- 3342US2007145604A1Chip structure and chip manufacturing processADVANCED SEMICONDUCTOR ENG·Filed 2006·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →