Inventor · disambiguated record
A Leam Choi
Also filed as: CHOI A LEAM
11 granted patents·1 pending application·74 citations·filing 2007–2011
88Inventor score
Technology areasH10W
Top patents by PatentIndex Score
12 records- 0194US8106498B2Integrated circuit packaging system with a dual board-on-chip structure and method of manufacture thereofSHIN HANGIL·Filed 2009·Granted Jan 31, 2012·38 cites·20 claims
- 0284US7859120B2Package system incorporating a flip-chip assemblySTATS CHIPPAC LTD·Filed 2008·Granted Dec 28, 2010·11 cites·10 claims
- 0381US8569869B2Integrated circuit packaging system with encapsulation and method of manufacture thereofPARK HYUNGSANG·Filed 2010·Granted Oct 29, 2013·7 cites·20 claims
- 0476US7859099B2Integrated circuit packaging system having through silicon via with direct interconnects and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2008·Granted Dec 28, 2010·6 cites·20 claims
- 0573US8183089B2Method for manufacturing package system incorporating flip-chip assemblyCHOI A LEAM·Filed 2010·Granted May 22, 2012·3 cites·10 claims
- 0670US8080446B2Integrated circuit packaging system with interposer interconnections and method of manufacture thereofCHOI A LEAM·Filed 2009·Granted Dec 20, 2011·4 cites·20 claims
- 0761US8558366B2Integrated circuit packaging system with interposer interconnections and method of manufacture thereofCHOI A LEAM·Filed 2011·Granted Oct 15, 2013·1 cites·20 claims
- 0859US8970044B2Integrated circuit packaging system with vertical interconnects and method of manufacture thereofCHOI A LEAM·Filed 2011·Granted Mar 3, 2015·1 cites·20 claims
- 0959US8699232B2Integrated circuit packaging system with interposer and method of manufacture thereofCHOI A LEAM·Filed 2011·Granted Apr 15, 2014·1 cites·9 claims
- 1059US8008787B2Integrated circuit package system with delamination prevention structureSTATS CHIPPAC LTD·Filed 2007·Granted Aug 30, 2011·2 cites·18 claims
- 1147US8093100B2Integrated circuit packaging system having through silicon via with direct interconnects and method of manufacture thereofCHOI A LEAM·Filed 2010·Granted Jan 10, 2012·0 cites·20 claims
- 1237US2012223435A1Integrated circuit packaging system with leads and method of manufacture thereofCHOI A LEAM·Filed 2011·Application pending·0 cites
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