Inventor · disambiguated record
Yee Kim Lee
Also filed as: LEE YEE KIM
4 granted patents·1 pending application·33 citations·filing 2007–2011
73Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0185US8097934B1Delamination resistant device package having low moisture sensitivityLI FELIX C·Filed 2008·Granted Jan 17, 2012·16 cites·42 claims
- 0284US7838980B1TO263 device package having low moisture sensitivityNAT SEMICONDUCTOR CORP·Filed 2007·Granted Nov 23, 2010·14 cites·12 claims
- 0365US8736042B2Delamination resistant device package having raised bond surface and mold locking apertureLI FELIX C·Filed 2011·Granted May 27, 2014·2 cites·15 claims
- 0445US8093707B2Leadframe packages having enhanced ground-bond reliabilityLEE SHAW WEI·Filed 2009·Granted Jan 10, 2012·1 cites·15 claims
- 0545US2011140253A1Dap ground bond enhancementNAT SEMICONDUCTOR CORP·Filed 2009·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →