Inventor · disambiguated record
Cheng-Cheng Liu
Also filed as: LIU CHENG-CHENG
4 granted patents·2 pending applications·73 citations·filing 2002–2023
71Inventor score
Files withADVANCED SEMICONDUCTOR ENG2ACCTON TECHNOLOGY CORP1LIU CHENG-CHENG1LIU JUN-CHENG1UNIV NAT TAIWAN SCIENCE & TECHNOLOGY1
Top patents by PatentIndex Score
6 records- 0186US7081678B2Multi-chip package combining wire-bonding and flip-chip configurationADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Jul 25, 2006·69 cites·12 claims
- 0263US2024243268A1Metal and Metallic Ion Mixed Batteries and a Method for Increasing Cycle Lifetime ThereofUNIV NAT TAIWAN SCIENCE & TECHNOLOGY·Filed 2023·Application pending·0 cites
- 0361US7763959B2Heat slug for package structureADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Jul 27, 2010·2 cites·20 claims
- 0445US6816030B2Impedance matching circuit for rejecting an image signal via a microstrip structureACCTON TECHNOLOGY CORP·Filed 2002·Granted Nov 9, 2004·2 cites·9 claims
- 0533US8800638B2Heatsink and heatsink-positioning systemLIU JUN-CHENG·Filed 2006·Granted Aug 12, 2014·0 cites·19 claims
- 0631US2006103021A1BGA package having substrate with exhaust holeLIU CHENG-CHENG·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →