Inventor · disambiguated record
Joyce S. Oey Hewett
Also filed as: HEWETT JOYCE S OBEY · HEWETT JOYCE S OEY
19 granted patents·256 citations·filing 2001–2005
95Inventor score
Files withADVANCED MICRO DEVICES INC19
Top patents by PatentIndex Score
19 records- 0184US7334202B1Optimizing critical dimension uniformity utilizing a resist bake plate simulatorADVANCED MICRO DEVICES INC·Filed 2005·Granted Feb 19, 2008·18 cites·25 claims
- 0283US6365422B1Automated variation of stepper exposure dose based upon across wafer variations in device characteristics, and system for accomplishing sameADVANCED MICRO DEVICES INC·Filed 2001·Granted Apr 2, 2002·25 cites·22 claims
- 0382US7103439B1Method and apparatus for initializing tool controllers based on tool event dataADVANCED MICRO DEVICES INC·Filed 2001·Granted Sep 5, 2006·19 cites·28 claims
- 0481US6595830B1Method of controlling chemical mechanical polishing operations to control erosion of insulating materialsADVANCED MICRO DEVICES INC·Filed 2001·Granted Jul 22, 2003·26 cites·26 claims
- 0580US6937914B1Method and apparatus for controlling process target values based on manufacturing metricsADVANCED MICRO DEVICES INC·Filed 2001·Granted Aug 30, 2005·16 cites·48 claims
- 0679US6534328B1Method of modeling and controlling the endpoint of chemical mechanical polishing operations performed on a process layer, and system for accomplishing sameADVANCED MICRO DEVICES INC·Filed 2001·Granted Mar 18, 2003·22 cites·22 claims
- 0778US6699727B1Method for prioritizing production lots based on grade estimates and output requirementsADVANCED MICRO DEVICES INC·Filed 2001·Granted Mar 2, 2004·21 cites·26 claims
- 0874US6588007B1Use of endpoint system to match individual processing stations within a toolADVANCED MICRO DEVICES INC·Filed 2001·Granted Jul 1, 2003·16 cites·38 claims
- 0972US6746958B1Method of controlling the duration of an endpoint polishing process in a multistage polishing processADVANCED MICRO DEVICES INC·Filed 2001·Granted Jun 8, 2004·19 cites·28 claims
- 1072US6576385B2Method of varying stepper exposure dose to compensate for across-wafer variations in photoresist thicknessADVANCED MICRO DEVICES INC·Filed 2001·Granted Jun 10, 2003·11 cites·43 claims
- 1169US6801817B1Method and apparatus for integrating multiple process controllersADVANCED MICRO DEVICES INC·Filed 2001·Granted Oct 5, 2004·14 cites·58 claims
- 1268US6969672B1Method and apparatus for controlling a thickness of a conductive layer in a semiconductor manufacturing operationADVANCED MICRO DEVICES INC·Filed 2001·Granted Nov 29, 2005·11 cites·13 claims
- 1368US6901340B1Method and apparatus for distinguishing between sources of process variationADVANCED MICRO DEVICES INC·Filed 2001·Granted May 31, 2005·11 cites·29 claims
- 1468US6632692B1Automated method of controlling critical dimensions of features by controlling stepper exposure dose, and system for accomplishing sameADVANCED MICRO DEVICES INC·Filed 2001·Granted Oct 14, 2003·9 cites·11 claims
- 1564US6970757B1Method and apparatus for updating control state variables of a process control model based on rework dataADVANCED MICRO DEVICES INC·Filed 2001·Granted Nov 29, 2005·10 cites·45 claims
- 1659US6569692B1Automated method of controlling photoresist develop time to control critical dimensions, and system for accomplishing sameADVANCED MICRO DEVICES INC·Filed 2001·Granted May 27, 2003·5 cites·19 claims
- 1754US6664013B1Methods of characterizing device performance based upon the duration of an endpointed photoresist develop process, and system for accomplishing sameADVANCED MICRO DEVICES INC·Filed 2001·Granted Dec 16, 2003·3 cites·35 claims
- 1842US6784001B2Automated variation of stepper exposure dose based upon across wafer variations in device characteristics, and system for accomplishing sameADVANCED MICRO DEVICES INC·Filed 2002·Granted Aug 31, 2004·0 cites·8 claims
- 1937US7120514B1Method and apparatus for performing field-to-field compensationADVANCED MICRO DEVICES INC·Filed 2001·Granted Oct 10, 2006·0 cites·34 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →