Inventor · disambiguated record
Hemant D. Desai
Also filed as: DESAI HEMANT · DESAI HEMANT D
19 granted patents·5 pending applications·256 citations·filing 1990–2023
95Inventor score
Top patents by PatentIndex Score
24 records- 0196US8487387B2MEMS sensor device with multi-stimulus sensingLIN YIZHEN·Filed 2012·Granted Jul 16, 2013·35 cites·20 claims
- 0296US8216882B2Method of producing a microelectromechanical (MEMS) sensor deviceLIN YIZHEN·Filed 2010·Granted Jul 10, 2012·33 cites·20 claims
- 0395US8316718B2MEMS pressure sensor device and method of fabricating sameLIN YIZHEN·Filed 2010·Granted Nov 27, 2012·18 cites·20 claims
- 0491US8692337B2Structure with a moving portion and a buried electrode for movement detection included in a multi-substrate configurationBERTHELOT AUDREY·Filed 2012·Granted Apr 8, 2014·26 cites·13 claims
- 0590US9726689B1Wafer level micro-electro-mechanical systems package with accelerometer and gyroscopeMAXIM INTEGRATED PRODUCTS·Filed 2013·Granted Aug 8, 2017·12 cites·6 claims
- 0686US9250262B1Method and apparatus for an integrated isolation mechanical filter with substrate based packageMAXIM INTEGRATED PRODUCTS·Filed 2013·Granted Feb 2, 2016·7 cites·10 claims
- 0784US9409765B1Method and apparatus for an isolating structureMAXIM INTEGRATED PRODUCTS·Filed 2013·Granted Aug 9, 2016·8 cites·17 claims
- 0883US7316965B2Substrate contact for a capped MEMS and method of making the substrate contact at the wafer levelFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Jan 8, 2008·13 cites·18 claims
- 0980US7846815B2Eutectic flow containment in a semiconductor fabrication processFREESCALE SEMICONDUCTOR INC·Filed 2009·Granted Dec 7, 2010·8 cites·11 claims
- 1079US7919006B2Method of anti-stiction dimple formation under MEMSFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Apr 5, 2011·9 cites·20 claims
- 1177US7585744B2Method of forming a seal for a semiconductor deviceFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Sep 8, 2009·23 cites·20 claims
- 1276US5102694APulsed chemical vapor deposition of gradient index optical materialCVD INC·Filed 1990·Granted Apr 7, 1992·45 cites·32 claims
- 1367US8921203B2Method of forming an integrated circuit having varying substrate depthKARLIN LISA H·Filed 2013·Granted Dec 30, 2014·2 cites·17 claims
- 1467US8525316B2Eutectic flow containment in a semiconductor fabrication processKARLIN LISA H·Filed 2010·Granted Sep 3, 2013·2 cites·16 claims
- 1565US8652865B2Attaching a MEMS to a bonding waferKARLIN LISA H·Filed 2011·Granted Feb 18, 2014·1 cites·5 claims
- 1660US9131325B2MEMS device assembly and method of packaging sameSCHLARMANN MARK E·Filed 2012·Granted Sep 8, 2015·1 cites·6 claims
- 1756US8461656B2Device structures for in-plane and out-of-plane sensing micro-electro-mechanical systems (MEMS)PARK WOO TAE·Filed 2010·Granted Jun 11, 2013·1 cites·16 claims
- 1853US9233836B2Semiconductor device including accelerometer devicesKARLIN LISA H·Filed 2014·Granted Jan 12, 2016·0 cites·20 claims
- 1951US2025068337A1Methods and apparatus to persistent platform service recordsINTEL CORP·Filed 2023·Application pending·0 cites
- 2041US5654034AComposite thermocouple protection tubesCVD INC·Filed 1996·Granted Aug 5, 1997·12 cites·6 claims
- 2141US2014225206A1Pressure level adjustment in a cavity of a semiconductor dieLIN YIZHEN·Filed 2013·Application pending·0 cites
- 2238US2006286706A1Method of making a substrate contact for a capped MEMS at the package levelSALIAN ARVIND S·Filed 2005·Application pending·0 cites
- 2335US2012107992A1Method of producing layered wafer structure having anti-stiction bumpsKARLIN LISA H·Filed 2010·Application pending·0 cites
- 2433US2007090474A1MEMS device and method of fabricationLI GARY G·Filed 2005·Application pending·0 cites
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