Inventor · disambiguated record
Isamu Togashi
Also filed as: TOGASHI ISAMU
54 granted patents·3 pending applications·48 citations·filing 2010–2020
97Inventor score
Top patents by PatentIndex Score
57 records- 0197US9346269B2Flow path structure, liquid ejecting head, and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2015·Granted May 24, 2016·8 cites·22 claims
- 0296US9950532B2Liquid ejecting head and manufacturing method thereofSEIKO EPSON CORP·Filed 2015·Granted Apr 24, 2018·8 cites·15 claims
- 0395US9707760B2Flow path structure, liquid ejecting head, and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2016·Granted Jul 18, 2017·4 cites·19 claims
- 0493US9315020B2Flow-path member, liquid ejecting head and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2015·Granted Apr 19, 2016·4 cites·20 claims
- 0592US10124586B2Flow path structure, liquid ejecting head, and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2017·Granted Nov 13, 2018·2 cites·19 claims
- 0691US9427964B2Liquid ejecting head and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2015·Granted Aug 30, 2016·3 cites·20 claims
- 0790US9878557B2Flow-path member, liquid ejecting head and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2016·Granted Jan 30, 2018·2 cites·18 claims
- 0886US9789685B2Flow path structure, liquid ejecting head, liquid ejecting apparatus, and manufacturing method of flow path structureSEIKO EPSON CORP·Filed 2016·Granted Oct 17, 2017·2 cites·25 claims
- 0983US9254656B2Liquid ejecting head, liquid ejecting apparatus, and manufacturing method of liquid ejecting headSEIKO EPSON CORP·Filed 2015·Granted Feb 9, 2016·2 cites·16 claims
- 1080US9789686B2Liquid ejecting head and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2016·Granted Oct 17, 2017·1 cites·20 claims
- 1179US10717277B2Flow path structure, liquid ejecting head, and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2019·Granted Jul 21, 2020·0 cites·17 claims
- 1278US9393783B2Liquid ejecting head and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2016·Granted Jul 19, 2016·1 cites·12 claims
- 1378US9090069B2Liquid ejecting head, liquid ejecting head unit, and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2014·Granted Jul 28, 2015·2 cites·20 claims
- 1477US11235575B2Flow path structure, liquid ejecting head, and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2020·Granted Feb 1, 2022·0 cites·18 claims
- 1577US9481167B2Liquid ejecting head and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2014·Granted Nov 1, 2016·2 cites·16 claims
- 1676US11104130B2Flow-path member, liquid ejecting head and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2020·Granted Aug 31, 2021·0 cites·20 claims
- 1776US9308725B2Liquid ejecting head and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2015·Granted Apr 12, 2016·1 cites·12 claims
- 1875US10549533B2Flow path structure, liquid ejecting head, and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2019·Granted Feb 4, 2020·0 cites·20 claims
- 1974US9403362B2Liquid ejecting head, liquid ejecting head unit, and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2014·Granted Aug 2, 2016·1 cites·20 claims
- 2073US10730295B2Flow-path member, liquid ejecting head and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2019·Granted Aug 4, 2020·0 cites·20 claims
- 2173US10286658B2Flow path member, liquid ejecting head, and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2018·Granted May 14, 2019·1 cites·17 claims
- 2273US9427965B2Liquid ejecting head and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2015·Granted Aug 30, 2016·1 cites·18 claims
- 2373US8636344B2Piezoelectric unit, liquid ejecting head, and liquid ejecting apparatusKODA TAKAFUMI·Filed 2012·Granted Jan 28, 2014·3 cites·12 claims
- 2472US10272683B2Flow path structure, liquid ejecting head, and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2018·Granted Apr 30, 2019·0 cites·19 claims
- 2568US10286662B2Flow-path member, liquid ejecting head and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2017·Granted May 14, 2019·0 cites·22 claims
- 2667US10059099B2Liquid ejecting head and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2017·Granted Aug 28, 2018·0 cites·17 claims
- 2766US9950531B2Liquid ejecting head, liquid ejecting head unit, and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2017·Granted Apr 24, 2018·0 cites·20 claims
- 2864US9844938B2Liquid ejecting head and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2016·Granted Dec 19, 2017·0 cites·21 claims
- 2963US9731507B2Liquid ejecting head, liquid ejecting head unit, and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2016·Granted Aug 15, 2017·0 cites·20 claims
- 3062US10328689B2Flow path structure, liquid ejecting head, liquid ejecting apparatus, and manufacturing method of flow path structureSEIKO EPSON CORP·Filed 2017·Granted Jun 25, 2019·0 cites·9 claims
- 3161US9662883B2Liquid ejecting head and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2016·Granted May 30, 2017·0 cites·14 claims
- 3260US9415596B2Liquid ejecting head and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2015·Granted Aug 16, 2016·0 cites·18 claims
- 3359US8905524B2Liquid ejecting head, liquid ejecting head unit, and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2014·Granted Dec 9, 2014·0 cites·21 claims
- 3456US9849702B2Liquid ejecting apparatusSEIKO EPSON CORP·Filed 2017·Granted Dec 26, 2017·0 cites·5 claims
- 3556US2017072721A1Ink jet printerSEIKO EPSON CORP·Filed 2016·Application pending·0 cites
- 3655US10226952B2Liquid ejecting apparatusSEIKO EPSON CORP·Filed 2017·Granted Mar 12, 2019·0 cites·18 claims
- 3754US10173429B2Liquid ejecting head, method for manufacturing the same, and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2016·Granted Jan 8, 2019·0 cites·15 claims
- 3853US10112394B2Liquid ejecting head unit and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2017·Granted Oct 30, 2018·0 cites·20 claims
- 3953US2015375545A1Ink jet printerSEIKO EPSON CORP·Filed 2015·Application pending·0 cites
- 4052US9211706B2Liquid ejecting apparatus and liquid ejecting head unitSEIKO EPSON CORP·Filed 2014·Granted Dec 15, 2015·0 cites·14 claims
- 4151US10046575B2Liquid spray deviceSEIKO EPSON CORP·Filed 2016·Granted Aug 14, 2018·0 cites·8 claims
- 4251US9873251B2Method of manufacturing flow path member, flow path member, and liquid ejecting headSEIKO EPSON CORP·Filed 2016·Granted Jan 23, 2018·0 cites·8 claims
- 4351US8894186B2Liquid ejecting apparatusSEIKO EPSON CORP·Filed 2013·Granted Nov 25, 2014·0 cites·6 claims
- 4451US8672459B2Liquid ejecting head, liquid ejecting head unit, and liquid ejecting apparatusTOGASHI ISAMU·Filed 2011·Granted Mar 18, 2014·0 cites·21 claims
- 4549US8870354B2Flow path member, liquid ejection head, liquid ejection apparatus and liquid storing unitSEIKO EPSON CORP·Filed 2013·Granted Oct 28, 2014·0 cites·13 claims
- 4648US9834004B2Flow channel structure and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2015·Granted Dec 5, 2017·0 cites·20 claims
- 4747US9090057B2Piezoelectric unit, liquid ejecting head, and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2013·Granted Jul 28, 2015·0 cites·9 claims
- 4846US9827763B2Liquid ejecting head and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2015·Granted Nov 28, 2017·0 cites·13 claims
- 4946US8622529B2Liquid ejecting head and liquid ejecting apparatusTOGASHI ISAMU·Filed 2012·Granted Jan 7, 2014·0 cites·4 claims
- 5045US8502354B2Break pattern of silicon wafer, silicon wafer, and silicon substrateTOGASHI ISAMU·Filed 2012·Granted Aug 6, 2013·0 cites·6 claims
Showing the top 50 of 57 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →