Inventor · disambiguated record
Moriya Miyashita
Also filed as: MIYASHITA MORIYA
11 granted patents·1 pending application·359 citations·filing 1988–2021
92Inventor score
Top patents by PatentIndex Score
12 records- 0186US5271796AMethod and apparatus for detecting defect on semiconductor substrate surfaceTOSHIBA KK·Filed 1992·Granted Dec 21, 1993·83 cites·20 claims
- 0285US7057259B2Semiconductor wafer with ID mark, equipment for and method of manufacturing semiconductor device from themTOSHIBA KK·Filed 2002·Granted Jun 6, 2006·35 cites·38 claims
- 0383US5071776AWafer processsing method for manufacturing wafers having contaminant-gettering damage on one surfaceTOSHIBA KK·Filed 1988·Granted Dec 10, 1991·74 cites·14 claims
- 0477US7700381B2Semiconductor wafer with ID mark, equipment for and method of manufacturing semiconductor device from themKABUSHIKIA KAISHA TOSHIBA·Filed 2006·Granted Apr 20, 2010·9 cites·1 claims
- 0571US4980300AGettering method for a semiconductor waferTOSHIBA KK·Filed 1988·Granted Dec 25, 1990·42 cites·22 claims
- 0668US4971920AGettering method for semiconductor wafersTOSHIBA KK·Filed 1988·Granted Nov 20, 1990·37 cites·16 claims
- 0767US11887845B2Method for producing three-dimensional structure, method for producing vertical transistor, vertical transistor wafer, and vertical transistor substrateGLOBALWAFERS JAPAN CO LTD·Filed 2021·Granted Jan 30, 2024·0 cites·5 claims
- 0865US5951755AManufacturing method of semiconductor substrate and inspection method thereforTOSHIBA KK·Filed 1997·Granted Sep 14, 1999·33 cites·20 claims
- 0956US6222252B1Semiconductor substrate and method for producing the sameTOSHIBA KK·Filed 1998·Granted Apr 24, 2001·16 cites·7 claims
- 1053US6037270AMethod of manufacturing semiconductor device and methods of processing, analyzing and manufacturing its substrateTOSHIBA KK·Filed 1995·Granted Mar 14, 2000·19 cites·23 claims
- 1150US2020211840A1Method for producing three-dimensional structure, method for producing vertical transistor, vertical transistor wafer, and vertical transistor substrateGLOBALWAFERS JAPAN CO LTD·Filed 2018·Application pending·0 cites
- 1239US5508800ASemiconductor substrate, method of manufacturing semiconductor substrate and semiconductor device, and method of inspecting and evaluating semiconductor substrateTOSHIBA KK·Filed 1993·Granted Apr 16, 1996·11 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →