Inventor · disambiguated record
Jason Keleher
Also filed as: KELEHER JASON · KELEHER JASON J
9 granted patents·6 pending applications·330 citations·filing 1999–2011
91Inventor score
Top patents by PatentIndex Score
15 records- 0194US8435421B2Metal-passivating CMP compositions and methodsKELEHER JASON·Filed 2011·Granted May 7, 2013·45 cites·11 claims
- 0290US6656241B1Silica-based slurryPPG IND OHIO INC·Filed 2001·Granted Dec 2, 2003·61 cites·29 claims
- 0390US6258721B1Diamond slurry for chemical-mechanical planarization of semiconductor wafersGEN ELECTRIC·Filed 1999·Granted Jul 10, 2001·113 cites·18 claims
- 0488US6242351B1Diamond slurry for chemical-mechanical planarization of semiconductor wafersGEN ELECTRIC·Filed 2000·Granted Jun 5, 2001·50 cites·33 claims
- 0587US7456107B2Compositions and methods for CMP of low-k-dielectric materialsCABOT MICROELECTRONICS CORP·Filed 2006·Granted Nov 25, 2008·15 cites·19 claims
- 0684US7955520B2Copper-passivating CMP compositions and methodsCABOT MICROELECTRONICS CORP·Filed 2007·Granted Jun 7, 2011·9 cites·9 claims
- 0777US6508953B1Slurry for chemical-mechanical polishing copper damascene structuresFERRO CORP·Filed 2000·Granted Jan 21, 2003·18 cites·19 claims
- 0876US6660639B2Method of fabricating a copper damascene structureFERRO CORP·Filed 2002·Granted Dec 9, 2003·16 cites·19 claims
- 0953US6916428B2Photo-chemical remediation of Cu-CMP wastePERSEE CHEMICAL CO LTD·Filed 2003·Granted Jul 12, 2005·3 cites·8 claims
- 1051US2008034670A1Chemically modified chemical mechanical polishing padPPG IND OHIO INC·Filed 2007·Application pending·0 cites
- 1150US2008203059A1Dilutable cmp composition containing a surfactantCABOT MICROELECTRONICS CORP·Filed 2007·Application pending·0 cites
- 1247US2011247996A1Dilutable cmp composition containing a surfactantCABOT MICROELECTRONICS CORP·Filed 2011·Application pending·0 cites
- 1345US2007037491A1Chemically modified chemical mechanical polishing pad, process of making a modified chemical mechanical polishing pad and method of chemical mechanical polishingLI YUZHUO·Filed 2005·Application pending·0 cites
- 1441US2009056231A1Copper CMP composition containing ionic polyelectrolyte and methodWHITE DANIELA·Filed 2007·Application pending·0 cites
- 1532US2004092102A1Chemical mechanical polishing composition and methodSACHEM INC·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →