Inventor · disambiguated record
Yasumasa Iwata
Also filed as: IWATA YASUMASA
16 granted patents·3 pending applications·26 citations·filing 2007–2017
89Inventor score
Top patents by PatentIndex Score
19 records- 0188US8882096B2Perforated support plateTOKYO OHKA KOGYO CO LTD·Filed 2013·Granted Nov 11, 2014·7 cites·16 claims
- 0284US9627235B2Supporting member separation methodTOKYO OHKA KOGYO CO LTD·Filed 2015·Granted Apr 18, 2017·4 cites·13 claims
- 0380US9881829B2Adhesive composition, laminate, and stripping methodTOKYO OHKA KOGYO CO LTD·Filed 2017·Granted Jan 30, 2018·2 cites·18 claims
- 0470US8167687B2Method of thinning wafer and support plateNAKAMURA AKIHIKO·Filed 2007·Granted May 1, 2012·3 cites·3 claims
- 0568US9607875B2Adhesive composition, laminate, and stripping methodTOKYO OHKA KOGYO CO LTD·Filed 2015·Granted Mar 28, 2017·1 cites·10 claims
- 0665US8186410B2Separating deviceNAKAMURA AKIHIKO·Filed 2008·Granted May 29, 2012·2 cites·16 claims
- 0763US8377256B2Stripping device and stripping methodTOKYO OHKA KOGYO CO LTD·Filed 2012·Granted Feb 19, 2013·1 cites·3 claims
- 0863US8302651B2Stripping device and stripping methodNAKADA KIMIHIRO·Filed 2011·Granted Nov 6, 2012·2 cites·7 claims
- 0961US8449691B2Liquid solvent abutment unitNAKAMURA AKIHIKO·Filed 2008·Granted May 28, 2013·1 cites·6 claims
- 1061US8181660B2Treatment liquid permeation unit and treating apparatusNAKAMURA AKIHIKO·Filed 2009·Granted May 22, 2012·1 cites·8 claims
- 1160US9129999B2Treatment device, treatment method, and surface treatment jigIWATA YASUMASA·Filed 2007·Granted Sep 8, 2015·2 cites·7 claims
- 1252US2009288780A1Perforated support plateNAKAMURA AKIHIKO·Filed 2007·Application pending·0 cites
- 1349US9682541B2Bonding methodTOKYO OHKA KOGYO CO LTD·Filed 2014·Granted Jun 20, 2017·0 cites·8 claims
- 1449US2009314438A1Supporting plate peeling apparatusTOKYO OHKA KOGYO CO LTD·Filed 2009·Application pending·0 cites
- 1548US8371317B2Surface treatment apparatusTOKYO OHKA KOGYO CO LTD·Filed 2008·Granted Feb 12, 2013·0 cites·12 claims
- 1648US8297331B2Separating apparatus and separating methodINAO YOSHIHIRO·Filed 2009·Granted Oct 30, 2012·0 cites·8 claims
- 1746US9484238B2Attachment methodTOKYO OHKA KOGYO CO LTD·Filed 2014·Granted Nov 1, 2016·0 cites·13 claims
- 1844US10607876B2Method for processing mold material and method for manufacturing structural bodyTOKYO OHKA KOGYO CO LTD·Filed 2014·Granted Mar 31, 2020·0 cites·18 claims
- 1935US2018233385A1Support body separating device and support body separating methodTOKYO OHKA KOGYO CO LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →