Inventor · disambiguated record
Yoshikatsu Mikami
Also filed as: MIKAMI YOSHIKATSU
6 granted patents·577 citations·filing 1984–1996
89Inventor score
Top patents by PatentIndex Score
6 records- 0193US4740657AAnisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtainedHITACHI CHEMICAL CO LTD·Filed 1987·Granted Apr 26, 1988·211 cites·25 claims
- 0292US5951918AComposite electroconductive powder, electroconductive paste, process for producing electroconductive paste, electric circuit and process for producing electric circuitHITACHI CHEMICAL CO LTD·Filed 1996·Granted Sep 14, 1999·106 cites·28 claims
- 0390US5804882ASemiconductor device having a semiconductor chip electrically connected to a wiring substrateHITACHI CHEMICAL CO LTD·Filed 1996·Granted Sep 8, 1998·142 cites·20 claims
- 0482US4690999ALow thermal expansion resin material and composite shaped articleHITACHI LTD·Filed 1984·Granted Sep 1, 1987·45 cites·12 claims
- 0578US4792476ALow thermal expansion resin material and composite shaped articleHITACHI LTD·Filed 1987·Granted Dec 20, 1988·45 cites·21 claims
- 0662US6166911ASemiconductor integrated circuit card assemblyHITACHI LTD·Filed 1996·Granted Dec 26, 2000·28 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →