Inventor · disambiguated record
Hidetoshi Kitaura
Also filed as: KITAURA HIDETOSHI
24 granted patents·16 pending applications·34 citations·filing 2010–2023
92Inventor score
Top patents by PatentIndex Score
40 records- 0195US9802206B2Method for producing graphenePANASONIC IP MAN CO LTD·Filed 2013·Granted Oct 31, 2017·16 cites·13 claims
- 0288US9746259B2Heat conductor and device including the samePANASONIC IP MAN CO LTD·Filed 2015·Granted Aug 29, 2017·4 cites·18 claims
- 0378US8810035B2Semiconductor bonding structure body and manufacturing method of semiconductor bonding structure bodyNAKAMURA TAICHI·Filed 2011·Granted Aug 19, 2014·5 cites·4 claims
- 0476US10357942B2Graphite-silicon composite and production method thereofPANASONIC IP MAN CO LTD·Filed 2016·Granted Jul 23, 2019·1 cites·6 claims
- 0572US10085495B2Clothing having cooling function or warming functionPANASONIC CORP·Filed 2013·Granted Oct 2, 2018·1 cites·6 claims
- 0672US9487690B2Anisotropic heat conductive composition and molded product thereofPANASONIC CORP·Filed 2012·Granted Nov 8, 2016·3 cites·13 claims
- 0772US8877318B2Graphite structure, and electronic device using the samePANASONIC CORP·Filed 2013·Granted Nov 4, 2014·3 cites·18 claims
- 0868US10493567B2Solder alloy and bonded structure using the samePANASONIC IP MAN CO LTD·Filed 2018·Granted Dec 3, 2019·1 cites·3 claims
- 0960US11040883B2Graphite plate and production method thereofPANASONIC IP MAN CO LTD·Filed 2017·Granted Jun 22, 2021·0 cites·11 claims
- 1059US10435607B2Graphite material and production method thereofPANASONIC IP MAN CO LTD·Filed 2017·Granted Oct 8, 2019·0 cites·5 claims
- 1159US2024088588A1Power converter, inter-component connection system, and inter-component connection methodPANASONIC IP MAN CO LTD·Filed 2023·Application pending·0 cites
- 1258US2024072476A1Electric power converting device, and board-to-board connecting portionPANASONIC IP MAN CO LTD·Filed 2023·Application pending·0 cites
- 1357US9379267B2Solar cell moduleYOSHIDA MASAKI·Filed 2012·Granted Jun 28, 2016·0 cites·13 claims
- 1456US9512289B2Anisotropic heat conductive compositionPANASONIC CORP·Filed 2014·Granted Dec 6, 2016·0 cites·6 claims
- 1555US10636724B2Mount structurePANASONIC IP MAN CO LTD·Filed 2018·Granted Apr 28, 2020·0 cites·9 claims
- 1653US11515280B2Mounting structure and nanoparticle mounting materialPANASONIC IP MAN CO LTD·Filed 2020·Granted Nov 29, 2022·0 cites·3 claims
- 1753US9981348B2Solder alloy and mounted structure using samePANASONIC IP MAN CO LTD·Filed 2016·Granted May 29, 2018·0 cites·5 claims
- 1852US2024213207A1Semiconductor module and method for manufacturing semiconductor modulePANASONIC HOLDINGS CORP·Filed 2022·Application pending·0 cites
- 1952US2023037202A1Power conversion devicePANASONIC IP MAN CO LTD·Filed 2022·Application pending·0 cites
- 2051US11135683B2Solder alloy and junction structure using samePANASONIC IP MAN CO LTD·Filed 2018·Granted Oct 5, 2021·0 cites·8 claims
- 2151US10960496B2Solder alloy and package structure using samePANASONIC IP MAN CO LTD·Filed 2017·Granted Mar 30, 2021·0 cites·5 claims
- 2249US11476399B2Jointing material, fabrication method for semiconductor device using the jointing material, and semiconductor devicePANASONIC IP MAN CO LTD·Filed 2018·Granted Oct 18, 2022·0 cites·8 claims
- 2349US2022045027A1Semiconductor device and method of manufacturing the samePANASONIC IP MAN CO LTD·Filed 2021·Application pending·0 cites
- 2449US2014041707A1Solar battery cell, junction structure, and solar battery cell fabrication methodKITAURA HIDETOSHI·Filed 2012·Application pending·0 cites
- 2549US2018154612A1Bonding material, bonded body obtained by the same, and manufacturing method of bonded bodyPANASONIC IP MAN CO LTD·Filed 2017·Application pending·0 cites
- 2647US8957521B2Mounted structurePANASONIC IP MAN CO LTD·Filed 2012·Granted Feb 17, 2015·0 cites·7 claims
- 2746US2018179066A1Carbon-metal compositePANASONIC IP MAN CO LTD·Filed 2017·Application pending·0 cites
- 2844US10170442B2Mount structure including two members that are bonded to each other with a bonding material layer having a first interface layer and a second interface layerPANASONIC IP MAN CO LTD·Filed 2017·Granted Jan 1, 2019·0 cites·6 claims
- 2942US8268718B2Bonded structure and manufacturing method for bonded structureNAKAMURA TAICHI·Filed 2011·Granted Sep 18, 2012·0 cites·3 claims
- 3042US2017015560A1Graphite plate and production method thereofPANASONIC IP MAN CO LTD·Filed 2016·Application pending·0 cites
- 3140US8338966B2Joint structure, joining material, and method for producing joining material containing bismuthFURUSAWA AKIO·Filed 2010·Granted Dec 25, 2012·0 cites·8 claims
- 3239US2014103531A1Bonded structureNAKAMURA TAICHI·Filed 2012·Application pending·0 cites
- 3338US10068869B2Mounting structure and BGA ballPANASONIC IP MAN CO LTD·Filed 2015·Granted Sep 4, 2018·0 cites·2 claims
- 3438US8691377B2Semiconductor deviceNAKAMURA TAICHI·Filed 2010·Granted Apr 8, 2014·0 cites·6 claims
- 3538US2018257179A1Solder alloy and joint structurePANASONIC IP MAN CO LTD·Filed 2018·Application pending·0 cites
- 3637US2011042817A1Solder joint structure, and joining method of the samePANASONIC CORP·Filed 2010·Application pending·0 cites
- 3737US2017282305A1Solder alloy and package structure using samePANASONIC IP MAN CO LTD·Filed 2016·Application pending·0 cites
- 3837US2012153461A1Semiconductor component, semiconductor wafer component, manufacturing method of semiconductor component, and manufacturing method of joining structureKITAURA HIDETOSHI·Filed 2010·Application pending·0 cites
- 3936US2018158747A1Heat sinkPANASONIC IP MAN CO LTD·Filed 2017·Application pending·0 cites
- 4036US2018218920A1Graphite heat sinkPANASONIC IP MAN CO LTD·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →