Inventor · disambiguated record
Arjun Krishnan
Also filed as: KRISHNAN ARJUN
17 granted patents·4 pending applications·220 citations·filing 1996–2018
92Inventor score
Top patents by PatentIndex Score
21 records- 0183US7490341B2System and associated terminal, method and computer program product for directional channel browsing of broadcast contentNOKIA CORP·Filed 2005·Granted Feb 10, 2009·13 cites·25 claims
- 0280US5924026AExchange of system and terminal capabilities over the same analog control channelNOKIA MOBILE PHONES LTD·Filed 1997·Granted Jul 13, 1999·100 cites·34 claims
- 0378US9620404B1Stiffener tape for electronic assembly that includes wafer or panelINTEL CORP·Filed 2015·Granted Apr 11, 2017·3 cites·17 claims
- 0476US7043261B2System, mobile station and method for delivering servicesNOKIA CORP·Filed 2003·Granted May 9, 2006·23 cites·26 claims
- 0575US5826191ADual mode network call forwarding activation and deactivationNOKIA MOBILE PHONES LTD·Filed 1996·Granted Oct 20, 1998·61 cites·33 claims
- 0669US8900919B2Robust ink formulations for durable markings on microelectronic packages and its extendibility as a barrier material for thermal and sealant materialsINTEL CORP·Filed 2013·Granted Dec 2, 2014·2 cites·19 claims
- 0768US9330993B2Methods of promoting adhesion between underfill and conductive bumps and structures formed therebyBAI YIQUN·Filed 2012·Granted May 3, 2016·3 cites·20 claims
- 0865US9631065B2Methods of forming wafer level underfill materials and structures formed therebyINTEL CORP·Filed 2013·Granted Apr 25, 2017·1 cites·42 claims
- 0965US9611372B2Narrow-gap flip chip underfill compositionINTEL CORP·Filed 2016·Granted Apr 4, 2017·1 cites·20 claims
- 1063US9269596B2Narrow-gap flip chip underfill compositionINTEL CORP·Filed 2013·Granted Feb 23, 2016·1 cites·20 claims
- 1162US8999765B2Methods to prevent filler entrapment in microelectronic device to microelectronic substrate interconnection structuresINTEL CORP·Filed 2013·Granted Apr 7, 2015·1 cites·16 claims
- 1256US9640415B2Robust ink formulations for durable markings on microelectronic packages and its extendibility as a barrier material for thermal and sealant materialsINTEL CORP·Filed 2014·Granted May 2, 2017·0 cites·14 claims
- 1353US9793151B2Stiffener tape for electronic assemblyINTEL CORP·Filed 2014·Granted Oct 17, 2017·0 cites·16 claims
- 1450US10115606B2Methods of promoting adhesion between underfill and conductive bumps and structures formed therebyINTEL CORP·Filed 2016·Granted Oct 30, 2018·0 cites·23 claims
- 1547US9230833B2Methods to prevent filler entrapment in microelectronic device to microelectronic substrate interconnection structuresINTEL CORP·Filed 2015·Granted Jan 5, 2016·0 cites·16 claims
- 1646US2005273327A1Mobile station and method for transmitting and receiving messagesNOKIA CORP·Filed 2004·Application pending·0 cites
- 1745US2013108883A1Thermoplastic polymer compositions with programmable end-of-life and method of making the sameEATON CORP·Filed 2012·Application pending·0 cites
- 1841US9704767B1Mold compound with reinforced fibersINTEL CORP·Filed 2015·Granted Jul 11, 2017·0 cites·20 claims
- 1939US6381453B1Dual mode network call forwarding activation and deactivationNOKIA MOBILE PHONES LTD·Filed 1998·Granted Apr 30, 2002·11 cites·10 claims
- 2035US2019393112A1Encapsulant material containing fluorophores for in-situ visualization of stress in an organic packageNOFEN ELIZABETH·Filed 2018·Application pending·0 cites
- 2135US2018286704A1Processes and methods for applying underfill to singulated dieINTEL CORP·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →