Inventor · disambiguated record
Yonghao Xiu
Also filed as: XIU YONGHAO
9 granted patents·3 pending applications·89 citations·filing 2006–2017
85Inventor score
Top patents by PatentIndex Score
12 records- 0194US8278191B2Methods and systems for metal-assisted chemical etching of substratesHILDRETH OWEN·Filed 2010·Granted Oct 2, 2012·50 cites·20 claims
- 0292US8916981B2Epoxy-amine underfill materials for semiconductor packagesXIU YONGHAO·Filed 2013·Granted Dec 23, 2014·31 cites·25 claims
- 0368US9431274B2Method for reducing underfill filler settling in integrated circuit packagesINTEL CORP·Filed 2012·Granted Aug 30, 2016·2 cites·7 claims
- 0468US9330993B2Methods of promoting adhesion between underfill and conductive bumps and structures formed therebyBAI YIQUN·Filed 2012·Granted May 3, 2016·3 cites·20 claims
- 0565US9611372B2Narrow-gap flip chip underfill compositionINTEL CORP·Filed 2016·Granted Apr 4, 2017·1 cites·20 claims
- 0663US9269596B2Narrow-gap flip chip underfill compositionINTEL CORP·Filed 2013·Granted Feb 23, 2016·1 cites·20 claims
- 0762US8999765B2Methods to prevent filler entrapment in microelectronic device to microelectronic substrate interconnection structuresINTEL CORP·Filed 2013·Granted Apr 7, 2015·1 cites·16 claims
- 0850US10115606B2Methods of promoting adhesion between underfill and conductive bumps and structures formed therebyINTEL CORP·Filed 2016·Granted Oct 30, 2018·0 cites·23 claims
- 0947US9230833B2Methods to prevent filler entrapment in microelectronic device to microelectronic substrate interconnection structuresINTEL CORP·Filed 2015·Granted Jan 5, 2016·0 cites·16 claims
- 1045US2016343591A1Reduction of underfill filler settling in integrated circuit packagesINTEL CORP·Filed 2016·Application pending·0 cites
- 1138US2009011222A1Superhydrophobic surface and method for forming sameGEORGIA TECH RES INST·Filed 2006·Application pending·0 cites
- 1235US2018286704A1Processes and methods for applying underfill to singulated dieINTEL CORP·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →