Inventor · disambiguated record
Ming-Chiang Lee
Also filed as: LEE MING-CHIANG
25 granted patents·2 pending applications·352 citations·filing 2008–2022
96Inventor score
Top patents by PatentIndex Score
27 records- 0197US8372689B2Wafer-level semiconductor device packages with three-dimensional fan-out and manufacturing methods thereofADVANCED SEMICONDUCTOR ENG·Filed 2010·Granted Feb 12, 2013·42 cites·20 claims
- 0296US9406658B2Embedded component device and manufacturing methods thereofLEE CHUN-CHE·Filed 2010·Granted Aug 2, 2016·107 cites·16 claims
- 0395US8569894B2Semiconductor package with single sided substrate design and manufacturing methods thereofSU YUAN-CHANG·Filed 2011·Granted Oct 29, 2013·27 cites·29 claims
- 0495US8320134B2Embedded component substrate and manufacturing methods thereofSU YUAN-CHANG·Filed 2010·Granted Nov 27, 2012·35 cites·20 claims
- 0594US7706149B2Micro-electro-mechanical-system package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Apr 27, 2010·38 cites·14 claims
- 0692US8284561B2Embedded component package structureSU YUAN-CHANG·Filed 2010·Granted Oct 9, 2012·16 cites·19 claims
- 0791US9190367B1Semiconductor package structure and semiconductor processADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Nov 17, 2015·14 cites·23 claims
- 0891US8884424B2Semiconductor package with single sided substrate design and manufacturing methods thereofADVANCED SEMICONDUCTOR ENG·Filed 2013·Granted Nov 11, 2014·12 cites·17 claims
- 0989US8288869B2Semiconductor package with substrate having single metal layer and manufacturing methods thereofHUANG SHIH-FU·Filed 2010·Granted Oct 16, 2012·15 cites·20 claims
- 1085US8487426B2Semiconductor package with embedded die and manufacturing methods thereofESSIG KAY STEPHAN·Filed 2011·Granted Jul 16, 2013·14 cites·20 claims
- 1183US10181438B2Semiconductor substrate mitigating bridgingADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Jan 15, 2019·4 cites·26 claims
- 1281US8416577B2Coreless substrate and method for making the sameWANG CHIEN-HAO·Filed 2010·Granted Apr 9, 2013·5 cites·14 claims
- 1376US10797022B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Oct 6, 2020·2 cites·20 claims
- 1475US7614888B2Flip chip package processADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Nov 10, 2009·7 cites·12 claims
- 1574US8510940B2Method of fabricating a multi-trace via substrateCHEN MIN-YAO·Filed 2010·Granted Aug 20, 2013·5 cites·19 claims
- 1671US9196597B2Semiconductor package with single sided substrate design and manufacturing methods thereofADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Nov 24, 2015·2 cites·18 claims
- 1770US2022359361A1Semiconductor substrate and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Application pending·0 cites
- 1868US8104171B2Method of fabricating multi-layered substrateAPPELT BERND KARL·Filed 2008·Granted Jan 31, 2012·2 cites·13 claims
- 1963US8665605B2Substrate structure and package structure using the sameCHEN KUO-HUA·Filed 2009·Granted Mar 4, 2014·2 cites·17 claims
- 2061US12218077B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Feb 4, 2025·0 cites·16 claims
- 2160US7993982B2Quad flat non-leaded package and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2009·Granted Aug 9, 2011·1 cites·16 claims
- 2259US11398421B2Semiconductor substrate and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Jul 26, 2022·0 cites·20 claims
- 2357US9578737B2Substrate structure and package structure using the sameADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Feb 21, 2017·0 cites·19 claims
- 2457US8497585B2Chip packageLEE MING-CHIANG·Filed 2011·Granted Jul 30, 2013·1 cites·12 claims
- 2557US8387239B2Manufacturing method of embedded circuit substrateWANG CHIEN-HAO·Filed 2009·Granted Mar 5, 2013·1 cites·15 claims
- 2648US2012073871A1Multi-layered substrateAPPELT BERND KARL·Filed 2011·Application pending·0 cites
- 2736US8059422B2Thermally enhanced package structureTONG HO-MING·Filed 2008·Granted Nov 15, 2011·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →