Inventor · disambiguated record
Pao-Ming Hsieh
Also filed as: HSIEH PAO-MING
6 granted patents·56 citations·filing 2009–2014
82Inventor score
Top patents by PatentIndex Score
6 records- 0195US8569894B2Semiconductor package with single sided substrate design and manufacturing methods thereofSU YUAN-CHANG·Filed 2011·Granted Oct 29, 2013·27 cites·29 claims
- 0291US8884424B2Semiconductor package with single sided substrate design and manufacturing methods thereofADVANCED SEMICONDUCTOR ENG·Filed 2013·Granted Nov 11, 2014·12 cites·17 claims
- 0385US8786062B2Semiconductor package and process for fabricating sameSU YUAN-CHANG·Filed 2010·Granted Jul 22, 2014·8 cites·6 claims
- 0471US9196597B2Semiconductor package with single sided substrate design and manufacturing methods thereofADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Nov 24, 2015·2 cites·18 claims
- 0571US8330267B2Semiconductor packageCHEN KUANG-HSIUNG·Filed 2009·Granted Dec 11, 2012·5 cites·20 claims
- 0669US9165900B2Semiconductor package and process for fabricating sameADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Oct 20, 2015·2 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →