Inventor · disambiguated record
Johann Winderl
Also filed as: WINDERL JOHANN
13 granted patents·147 citations·filing 1998–2003
91Inventor score
Files withINFINEON TECHNOLOGIES AG13
Top patents by PatentIndex Score
13 records- 0180US6525416B2Electronic devices and a sheet strip for packaging bonding wire connections of electronic devices and method for producing themINFINEON TECHNOLOGIES AG·Filed 2001·Granted Feb 25, 2003·32 cites·15 claims
- 0277US6894378B2Electronic component with stacked semiconductor chipsINFINEON TECHNOLOGIES AG·Filed 2002·Granted May 17, 2005·23 cites·21 claims
- 0373US6521988B2Device for packaging electronic componentsINFINEON TECHNOLOGIES AG·Filed 2001·Granted Feb 18, 2003·21 cites·10 claims
- 0467US6534345B1Method for mounting a semiconductor chip on a carrier layer and device for carrying out the methodINFINEON TECHNOLOGIES AG·Filed 2000·Granted Mar 18, 2003·15 cites·5 claims
- 0566US6364751B1Method for singling semiconductor components and semiconductor component singling deviceINFINEON TECHNOLOGIES AG·Filed 2000·Granted Apr 2, 2002·11 cites·16 claims
- 0663US6664648B2Apparatus for applying a semiconductor chip to a carrier element with a compensating layerINFINEON TECHNOLOGIES AG·Filed 2001·Granted Dec 16, 2003·10 cites·12 claims
- 0756US6430809B1Method for bonding conductors, in particular beam leadsINFINEON TECHNOLOGIES AG·Filed 2000·Granted Aug 13, 2002·9 cites·4 claims
- 0855US6486538B1Chip carrier having ventilation channelsINFINEON TECHNOLOGIES AG·Filed 2000·Granted Nov 26, 2002·7 cites·4 claims
- 0954US6614100B1Lead frame for the installation of an integrated circuit in an injection-molded packageINFINEON TECHNOLOGIES AG·Filed 1998·Granted Sep 2, 2003·19 cites·8 claims
- 1041US7008493B2Method for applying a semiconductor chip to a carrier elementINFINEON TECHNOLOGIES AG·Filed 2003·Granted Mar 7, 2006·0 cites·7 claims
- 1136US7036216B2Method and apparatus for connecting at least one chip to an external wiring configurationINFINEON TECHNOLOGIES AG·Filed 2002·Granted May 2, 2006·0 cites·16 claims
- 1233US6891252B2Electronic component with a semiconductor chip and method of producing an electronic componentINFINEON TECHNOLOGIES AG·Filed 2002·Granted May 10, 2005·0 cites·14 claims
- 1333US6429537B2Semiconductor component with method for manufacturingINFINEON TECHNOLOGIES AG·Filed 2001·Granted Aug 6, 2002·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →