Inventor · disambiguated record
Lixiong Luo
Also filed as: LUO LIXIONG
5 granted patents·277 citations·filing 1998–2009
80Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0193US6249041B1IC chip package with directly connected leadsSILICONIX INC·Filed 1998·Granted Jun 19, 2001·196 cites·13 claims
- 0285US6744124B1Semiconductor die package including cup-shaped leadframeSILICONIX INC·Filed 1999·Granted Jun 1, 2004·75 cites·9 claims
- 0355US6909170B2Semiconductor assembly with package using cup-shaped lead-frameSILICONIX INC·Filed 2002·Granted Jun 21, 2005·6 cites·8 claims
- 0446US9040356B2Semiconductor including cup-shaped leadframe packaging techniquesCHANG MIKE·Filed 2009·Granted May 26, 2015·0 cites·24 claims
- 0546US7595547B1Semiconductor die package including cup-shaped leadframeVISHAY SILICONIX·Filed 2005·Granted Sep 29, 2009·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →