Inventor · disambiguated record
Hideo Kotani
Also filed as: KOTANI HIDEO
5 granted patents·165 citations·filing 1981–1992
83Inventor score
Files withMITSUBISHI ELECTRIC CORP5
Top patents by PatentIndex Score
5 records- 0186US4977105AMethod for manufacturing interconnection structure in semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1989·Granted Dec 11, 1990·83 cites·4 claims
- 0259US4872050AInterconnection structure in semiconductor device and manufacturing method of the sameMITSUBISHI ELECTRIC CORP·Filed 1988·Granted Oct 3, 1989·26 cites·8 claims
- 0357US5132774ASemiconductor device including interlayer insulating filmMITSUBISHI ELECTRIC CORP·Filed 1990·Granted Jul 21, 1992·29 cites·6 claims
- 0450US5250468AMethod of manufacturing semiconductor device including interlaying insulating filmMITSUBISHI ELECTRIC CORP·Filed 1992·Granted Oct 5, 1993·21 cites·5 claims
- 0533US4411929AMethod for manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1981·Granted Oct 25, 1983·6 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →