Inventor · disambiguated record
Kenshu Oyama
Also filed as: OYAMA KENSHU
9 granted patents·305 citations·filing 1990–2015
90Inventor score
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD5HARIMA CHEMICALS INC1ISHIHARA MASAMICHI1SHIKOKU INSTR CO LTD1SS TECHNO INC1
Top patents by PatentIndex Score
9 records- 0193US5153983ARotary head type electrical component placing apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1991·Granted Oct 13, 1992·121 cites·4 claims
- 0287US9682438B2Steam reflow apparatus and steam reflow methodSS TECHNO INC·Filed 2015·Granted Jun 20, 2017·5 cites·6 claims
- 0381US5406699AMethod of manufacturing an electronics packageMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1993·Granted Apr 18, 1995·74 cites·12 claims
- 0476US9812621B2Semiconductor device and fabrication method for sameISHIHARA MASAMICHI·Filed 2012·Granted Nov 7, 2017·5 cites·14 claims
- 0573US7452797B2Solder deposition method and solder bump forming methodHARIMA CHEMICALS INC·Filed 2004·Granted Nov 18, 2008·24 cites·15 claims
- 0672US9698327B2LED illumination module and LED illumination apparatusSHIKOKU INSTR CO LTD·Filed 2013·Granted Jul 4, 2017·3 cites·22 claims
- 0770US5131139AElectrical component placing apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1991·Granted Jul 21, 1992·30 cites·3 claims
- 0864US5115559AElectronic component mounting apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1990·Granted May 26, 1992·25 cites·4 claims
- 0953US5177864AElectronic component mounting apparatus and method of mounting electronic componentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1991·Granted Jan 12, 1993·18 cites·4 claims
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