Inventor · disambiguated record
Chieh-Te Chen
Also filed as: CHEN CHIEH-TE
62 granted patents·5 pending applications·215 citations·filing 1999–2020
98Inventor score
Files withUNITED MICROELECTRONICS CORP56CHEN CHIEH-TE5DER EE ELECTRICAL INSTR CO LTD1HSU CHING-PIN1HWANG GUANG-YAW1
Top patents by PatentIndex Score
67 records- 0196US10049929B2Method of making semiconductor structure having contact plugUNITED MICROELECTRONICS CORP·Filed 2016·Granted Aug 14, 2018·11 cites·12 claims
- 0296US10043809B1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Aug 7, 2018·17 cites·8 claims
- 0395US8962490B1Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2013·Granted Feb 24, 2015·19 cites·10 claims
- 0494US10186513B2Semiconductor device and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jan 22, 2019·9 cites·8 claims
- 0594US9349812B2Semiconductor device with self-aligned contact and method of manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2013·Granted May 24, 2016·18 cites·9 claims
- 0692US10373957B2Capacitor structure and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2017·Granted Aug 6, 2019·6 cites·12 claims
- 0789US8916475B1Patterning methodUNITED MICROELECTRONICS CORP·Filed 2013·Granted Dec 23, 2014·12 cites·17 claims
- 0888US8993433B2Manufacturing method for forming a self aligned contactUNITED MICROELECTRONICS CORP·Filed 2013·Granted Mar 31, 2015·9 cites·13 claims
- 0987US9673100B2Semiconductor device having contact plug in two dielectric layers and two etch stop layersUNITED MICROELECTRONICS CORP·Filed 2014·Granted Jun 6, 2017·7 cites·6 claims
- 1087US9054172B2Semiconductor structure having contact plug and method of making the sameUNITED MICROELECTRNICS CORP·Filed 2012·Granted Jun 9, 2015·9 cites·10 claims
- 1185US10249629B1Method for forming buried word linesUNITED MICROELECTRONICS CORP·Filed 2018·Granted Apr 2, 2019·4 cites·14 claims
- 1285US8785283B2Method for forming semiconductor structure having metal connectionUNITED MICROELECTRONICS CORP·Filed 2012·Granted Jul 22, 2014·8 cites·15 claims
- 1383US10347644B2Manufacturing method of semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jul 9, 2019·3 cites·11 claims
- 1483US10312090B2Patterning methodUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jun 4, 2019·3 cites·16 claims
- 1583US9728455B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Aug 8, 2017·3 cites·8 claims
- 1682US9023708B2Method of forming semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2013·Granted May 5, 2015·6 cites·18 claims
- 1781US10818664B2Method of forming semiconductor memory deviceUNITED MICROELECTRONICS CORP·Filed 2019·Granted Oct 27, 2020·2 cites·12 claims
- 1881US8552503B2Strained silicon structureHWANG GUANG-YAW·Filed 2010·Granted Oct 8, 2013·6 cites·12 claims
- 1979US11107879B2Capacitor structure and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2018·Granted Aug 31, 2021·3 cites·18 claims
- 2078US10593677B2Semiconductor structure with capacitor landing pad and method of make the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Mar 17, 2020·2 cites·7 claims
- 2172US10825818B2Method of forming semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2018·Granted Nov 3, 2020·1 cites·9 claims
- 2272US10559651B2Method of forming memory capacitorUNITED MICROELECTRONICS CORP·Filed 2018·Granted Feb 11, 2020·1 cites·9 claims
- 2372US10366889B2Method of forming semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jul 30, 2019·1 cites·16 claims
- 2472US9318571B2Gate structure and method for trimming spacersWANG I-CHANG·Filed 2009·Granted Apr 19, 2016·6 cites·8 claims
- 2572US7075289B2Wireless remote control measuring multipurpose meterDER EE ELECTRICAL INSTR CO LTD·Filed 2004·Granted Jul 11, 2006·18 cites·8 claims
- 2671US10418367B2Method for fabricating air gap adjacent to two sides of bit lineUNITED MICROELECTRONICS CORP·Filed 2018·Granted Sep 17, 2019·1 cites·20 claims
- 2771US8026571B2Semiconductor-device isolation structureUNITED MICROELECTRONICS CORP·Filed 2008·Granted Sep 27, 2011·6 cites·5 claims
- 2870US10361080B2Patterning methodUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jul 23, 2019·1 cites·13 claims
- 2969US10658366B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted May 19, 2020·1 cites·19 claims
- 3068US11289489B2Capacitor structureUNITED MICROELECTRONICS CORP·Filed 2020·Granted Mar 29, 2022·0 cites·9 claims
- 3168US10490555B2Method of forming semiconductor memory deviceUNITED MICROELECTRONICS CORP·Filed 2018·Granted Nov 26, 2019·1 cites·11 claims
- 3267US9196524B2Manufacturing method of semiconductor deviceCHEN CHIEH-TE·Filed 2012·Granted Nov 24, 2015·2 cites·10 claims
- 3367US9196352B2Static random access memory unit cell structure and static random access memory unit cell layout structureUNITED MICROELECTRONICS CORP·Filed 2013·Granted Nov 24, 2015·2 cites·18 claims
- 3464US9165997B2Semiconductor processUNITED MICROELECTRONICS CORP·Filed 2014·Granted Oct 20, 2015·1 cites·10 claims
- 3562US10622362B2Capacitor structure and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2019·Granted Apr 14, 2020·0 cites·4 claims
- 3662US9748349B2Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2015·Granted Aug 29, 2017·1 cites·12 claims
- 3762US9312258B2Strained silicon structureUNITED MICROELECTRONICS CORP·Filed 2013·Granted Apr 12, 2016·1 cites·18 claims
- 3861US9337084B1Method for manufacturing contact holes of a semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2015·Granted May 10, 2016·1 cites·14 claims
- 3958US2020176453A1Semiconductor structure with capacitor landing pad and method of make the sameUNITED MICROELECTRONICS CORP·Filed 2020·Application pending·0 cites
- 4057US10784265B2Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2019·Granted Sep 22, 2020·0 cites·4 claims
- 4155US8835324B2Method for forming contact holesCHEN CHIEH-TE·Filed 2011·Granted Sep 16, 2014·1 cites·13 claims
- 4254US9620369B2Method for fabricating semiconductor device to integrate transistor with passive deviceUNITED MICROELECTRONICS CORP·Filed 2013·Granted Apr 11, 2017·0 cites·9 claims
- 4354US9281367B2Semiconductor structure having contact plug and method of making the sameUNITED MICROELECTRONICS CORP·Filed 2015·Granted Mar 8, 2016·0 cites·10 claims
- 4451US9455135B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2014·Granted Sep 27, 2016·0 cites·8 claims
- 4550US10734284B2Method of self-aligned double patterningUNITED MICROELECTRONICS CORP·Filed 2018·Granted Aug 4, 2020·0 cites·7 claims
- 4649US9583388B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2015·Granted Feb 28, 2017·0 cites·5 claims
- 4749US8633549B2Semiconductor device and fabrication method thereofCHEN CHIEH-TE·Filed 2011·Granted Jan 21, 2014·0 cites·7 claims
- 4848US10446554B2Semiconductor memory device and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Oct 15, 2019·0 cites·3 claims
- 4948US8952392B2Semiconductor structure and process thereofCHEN CHIEH-TE·Filed 2012·Granted Feb 10, 2015·0 cites·11 claims
- 5047US10658173B2Method for fabricating a semiconductor structure on a semiconductor waferUNITED MICROELECTRONICS CORP·Filed 2018·Granted May 19, 2020·0 cites·9 claims
Showing the top 50 of 67 patent records by PatentIndex Score.
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