Inventor · disambiguated record
Chun Kui Ji
Also filed as: JI CHUN · JI CHUN KUI
4 granted patents·7 citations·filing 2006–2009
66Inventor score
Top patents by PatentIndex Score
4 records- 0155US7932739B2BGA package holder device and method for testing of BGA packagesSEMICONDUCTOR MFG INT SHANGHAI·Filed 2009·Granted Apr 26, 2011·3 cites·16 claims
- 0254US7772030B2Multipurpose decapsulation holder and method for a ball grid array packageSEMICONDUCTOR MFG INT SHANGHAI·Filed 2006·Granted Aug 10, 2010·2 cites·14 claims
- 0349US7541827B2BGA package holder device and method for testing of BGA packagesSEMICONDUCTOR MFG INT SHANGHAI·Filed 2006·Granted Jun 2, 2009·2 cites·12 claims
- 0440US8646246B2Method of preparing a composition in blister packagesLI HEWEI·Filed 2008·Granted Feb 11, 2014·0 cites·11 claims
Join the waitlist — get patent alerts
Get an alert when Chun Kui Ji files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →