Inventor · disambiguated record
Kyungsic Yu
Also filed as: YU KYUNGSIC
3 granted patents·3 citations·filing 2006–2016
54Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0163US7851268B2Integrated circuit package system using heat slugSTATS CHIPPAC LTD·Filed 2006·Granted Dec 14, 2010·3 cites·10 claims
- 0244US8022531B2Integrated circuit package system using heat slugSTATS CHIPPAC LTD·Filed 2010·Granted Sep 20, 2011·0 cites·10 claims
- 0331US10854556B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG KOREA INC·Filed 2016·Granted Dec 1, 2020·0 cites·12 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →