Inventor · disambiguated record
Roy Zeighami
Also filed as: ZEIGHAMI ROY · ZEIGHAMI ROY M · ZEIGHAMI ROY MEHDI
29 granted patents·11 pending applications·423 citations·filing 2001–2024
97Inventor score
Files withHEWLETT PACKARD DEVELOPMENT CO14ORACLE INT CORP9RUBENSTEIN BRANDON4BELADY CHRISTIAN L2CISCO TECH INC2
Top patents by PatentIndex Score
40 records- 0197US12007734B2Datacenter level power management with reactive power cappingORACLE INT CORP·Filed 2023·Granted Jun 11, 2024·4 cites·20 claims
- 0293US7286352B2Thermally expanding base of heatsink to receive finsHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Oct 23, 2007·28 cites·20 claims
- 0391US9007221B2Liquid cooling of rack-mounted electronic equipmentCISCO TECH INC·Filed 2013·Granted Apr 14, 2015·21 cites·20 claims
- 0490US6819562B2Cooling apparatus for stacked componentsHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Nov 16, 2004·57 cites·12 claims
- 0589US8203837B2Cooling systemZEIGHAMI ROY·Filed 2010·Granted Jun 19, 2012·24 cites·15 claims
- 0688US12155210B2Techniques for orchestrated load sheddingORACLE INT CORP·Filed 2023·Granted Nov 26, 2024·1 cites·19 claims
- 0788US6508621B1Enhanced performance air moving assemblyHEWLETT PACKARD CO·Filed 2001·Granted Jan 21, 2003·44 cites·17 claims
- 0886US6538887B2Fan blade providing enhanced performance in air movementHEWLETT PACKARD CO·Filed 2001·Granted Mar 25, 2003·34 cites·20 claims
- 0984US9019704B2Heat storage by phase-change materialRUBENSTEIN BRANDON·Filed 2009·Granted Apr 28, 2015·13 cites·15 claims
- 1084US7011144B2System and method for cooling electronic assembliesHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Mar 14, 2006·26 cites·9 claims
- 1180US9549488B2Liquid cooling of rack-mounted electronic equipmentCISCO TECH INC·Filed 2015·Granted Jan 17, 2017·4 cites·20 claims
- 1278US7305518B2Method and system for dynamically adjusting DRAM refresh rateHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Dec 4, 2007·26 cites·31 claims
- 1378US7096926B2Thermal pouch interfaceHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Aug 29, 2006·21 cites·10 claims
- 1477US7002801B2Method of cooling semiconductor die using microchannel thermosyphonHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Feb 21, 2006·19 cites·6 claims
- 1575US12444941B2Techniques for orchestrated load sheddingORACLE INT CORP·Filed 2023·Granted Oct 14, 2025·0 cites·20 claims
- 1675US12176711B2Techniques for orchestrated load sheddingORACLE INT CORP·Filed 2023·Granted Dec 24, 2024·0 cites·20 claims
- 1775US9201486B2Large scale dynamic power budget adjustments for optimizing power utilization in a data centerJAGADISHPRASAD PRAVEEN K·Filed 2012·Granted Dec 1, 2015·9 cites·24 claims
- 1874US12340258B2Burst datacenter capacity for hyperscale workloadsORACLE INT CORP·Filed 2023·Granted Jun 24, 2025·0 cites·20 claims
- 1974US7120022B2Loop thermosyphon with wicking structure and semiconductor die as evaporatorHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Oct 10, 2006·19 cites·28 claims
- 2074US6704200B2Loop thermosyphon using microchannel etched semiconductor die as evaporatorHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Mar 9, 2004·17 cites·13 claims
- 2173US7475175B2Multi-processor moduleHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Jan 6, 2009·19 cites·40 claims
- 2271US9055698B2Fluid flow control for computing deviceRUBENSTEIN BRANDON·Filed 2010·Granted Jun 9, 2015·3 cites·16 claims
- 2370US11847506B1Burst datacenter capacity for hyperscale workloadsORACLE INT CORP·Filed 2022·Granted Dec 19, 2023·0 cites·17 claims
- 2470US6625026B1Heat-activated self-aligning heat sinkHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Sep 23, 2003·17 cites·44 claims
- 2569US12429840B2Datacenter level power management with reactive power cappingORACLE INT CORP·Filed 2024·Granted Sep 30, 2025·0 cites·16 claims
- 2666US7533303B2Method and system for performing system-level correction of memory errorsHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted May 12, 2009·6 cites·27 claims
- 2762US2025062614A1Techniques for orchestrated load sheddingORACLE INT CORP·Filed 2024·Application pending·0 cites
- 2860US2024339834A1Techniques for orchestrated load sheddingORACLE INT CORP·Filed 2024·Application pending·0 cites
- 2959US7111666B2Heat sinkHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Sep 26, 2006·5 cites·3 claims
- 3055US6989623B2Method and apparatus for measurement using piezoelectric sensorHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Jan 24, 2006·6 cites·33 claims
- 3151US2012039036A1Thermal bus bar for a blade enclosureKRAUSE MICHAEL R·Filed 2009·Application pending·0 cites
- 3250US10879732B2Power supply mode selectionMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2018·Granted Dec 29, 2020·0 cites·14 claims
- 3345US2005219820A1System and method for heat dissipationBELADY CHRISTIAN L·Filed 2004·Application pending·0 cites
- 3444US2011085296A1Cooling System For A Computer BladeRUBENSTEIN BRANDON·Filed 2009·Application pending·0 cites
- 3540US2005116546A1Power supply systemFiled 2003·Application pending·0 cites
- 3639US2005207115A1Heat dissipating arrangementHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Application pending·0 cites
- 3739US2003178174A1Thermal pouch interfaceFiled 2002·Application pending·0 cites
- 3836US2012331477A1System and method for dynamically allocating high-quality and low-quality facility assets at the datacenter levelZEIGHAMI ROY·Filed 2010·Application pending·0 cites
- 3935US2006048932A1Configurable heat sinkRUBENSTEIN BRANDON·Filed 2004·Application pending·0 cites
- 4032US2005254208A1Air flow direction neutral heat transfer deviceBELADY CHRISTIAN L·Filed 2004·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →