Inventor · disambiguated record
Yoshiaki Udagawa
Also filed as: UDAGAWA YOSHIAKI
13 granted patents·1 pending application·961 citations·filing 1977–2004
95Inventor score
Top patents by PatentIndex Score
14 records- 0196US7007506B2Refrigeration system utilizing incomplete evaporation of refrigerant in evaporatorFUJITSU LTD·Filed 2004·Granted Mar 7, 2006·109 cites·8 claims
- 0295US5936843APrinted wiring board with mounted circuit element using a terminal density conversion boardFUJITSU LTD·Filed 1998·Granted Aug 10, 1999·186 cites·11 claims
- 0394US6621707B2Liquid-cooled electronic apparatusFUJITSU LTD·Filed 2001·Granted Sep 16, 2003·94 cites·9 claims
- 0491US4729060ACooling system for electronic circuit deviceFUJITSU LTD·Filed 1985·Granted Mar 1, 1988·120 cites·32 claims
- 0589US4920574ACooling system for an electronic circuit deviceFUJITSU LTD·Filed 1987·Granted Apr 24, 1990·87 cites·11 claims
- 0688US5126919ACooling system for an electronic circuit deviceFUJITSU LTD·Filed 1988·Granted Jun 30, 1992·83 cites·38 claims
- 0788US4783721ACooling system for an electronic circuit deviceFUJITSU LTD·Filed 1987·Granted Nov 8, 1988·73 cites·9 claims
- 0886US6748755B2Refrigeration system utilizing incomplete evaporation of refrigerant in evaporatorFUJITSU LTD·Filed 2000·Granted Jun 15, 2004·38 cites·7 claims
- 0986US4879632ACooling system for an electronic circuit deviceFUJITSU LTD·Filed 1986·Granted Nov 7, 1989·67 cites·36 claims
- 1076US4158220APrinted circuit card constructionFUJITSU LTD·Filed 1977·Granted Jun 12, 1979·30 cites·19 claims
- 1172US5195020ACooling system used with an electronic circuit device for cooling circuit components included therein having a thermally conductive compound layer and method for forming the layerFUJITSU LTD·Filed 1991·Granted Mar 16, 1993·46 cites·15 claims
- 1259US6397459B2Printed wiring board with mounted circuit elements using a terminal density conversion boardFUJITSU LTD·Filed 1999·Granted Jun 4, 2002·21 cites·4 claims
- 1337US2003005584A1Assembly including heat pipe and heat conductive member fixed to each other by plastic deformation of the latter, and method of manufacturing the assemblySUMITOMO LIGHT METAL IND·Filed 2002·Application pending·0 cites
- 1435US6454362B1Method of controlling cooling device in portable electronic and cooling device thereforFUJITSU LTD·Filed 1999·Granted Sep 24, 2002·7 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →