Inventor · disambiguated record
Margie T. Rios
Also filed as: RIOS MARGIE · RIOS MARGIE T
11 granted patents·2 pending applications·280 citations·filing 2003–2016
90Inventor score
Technology areasH10W
Top patents by PatentIndex Score
13 records- 0196US7271497B2Dual metal stud bumping for flip chip applicationsFAIRCHILD SEMICONDUCTOR·Filed 2003·Granted Sep 18, 2007·110 cites·13 claims
- 0296US6943434B2Method for maintaining solder thickness in flipchip attach packaging processesFAIRCHILD SEMICONDUCTOR·Filed 2003·Granted Sep 13, 2005·133 cites·24 claims
- 0383US8088645B23D smart power moduleLIU YONG·Filed 2010·Granted Jan 3, 2012·6 cites·10 claims
- 0480US8030743B2Semiconductor package with an embedded printed circuit board and stacked dieFAIRCHILD SEMICONDUCTOR·Filed 2008·Granted Oct 4, 2011·8 cites·11 claims
- 0580US7501337B2Dual metal stud bumping for flip chip applicationsFAIRCHILD SEMICONDUCTOR·Filed 2006·Granted Mar 10, 2009·7 cites·7 claims
- 0677US7808101B23D smart power moduleFAIRCHILD SEMICONDUCTOR·Filed 2008·Granted Oct 5, 2010·6 cites·17 claims
- 0768US8426953B2Semiconductor package with an embedded printed circuit board and stacked dieLIU YONG·Filed 2011·Granted Apr 23, 2013·2 cites·10 claims
- 0866US7932171B2Dual metal stud bumping for flip chip applicationsFAIRCHILD SEMICONDUCTOR·Filed 2009·Granted Apr 26, 2011·2 cites·19 claims
- 0966US7586179B2Wireless semiconductor package for efficient heat dissipationFAIRCHILD SEMICONDUCTOR·Filed 2007·Granted Sep 8, 2009·4 cites·13 claims
- 1060US8063472B2Semiconductor package with stacked dice for a buck converterLIU YONG·Filed 2008·Granted Nov 22, 2011·2 cites·18 claims
- 1145US2005224940A1Method for maintaining solder thickness in flipchip attach packaging processesTANGPUZ CONSUELO N·Filed 2005·Application pending·0 cites
- 1237US9685398B2Thin semiconductor device packagesFAIRCHILD SEMICONDUCTOR·Filed 2016·Granted Jun 20, 2017·0 cites·21 claims
- 1333US2007222087A1Semiconductor device with solderable loop contactsLEE SANGDO·Filed 2007·Application pending·0 cites
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