Inventor · disambiguated record
Toshiya Ishio
Also filed as: ISHIO TOSHIYA
18 granted patents·6 pending applications·654 citations·filing 1996–2020
95Inventor score
Top patents by PatentIndex Score
24 records- 0193US6118184ASemiconductor device sealed with a sealing resin and including structure to balance sealing resin flowSHARP KK·Filed 1998·Granted Sep 12, 2000·187 cites·12 claims
- 0292US7667336B2Semiconductor device and method for manufacturing the sameSHARP KK·Filed 2007·Granted Feb 23, 2010·25 cites·36 claims
- 0392US6838748B2Semiconductor element with electromagnetic shielding layer on back/side face(s) thereofSHARP KK·Filed 2003·Granted Jan 4, 2005·70 cites·18 claims
- 0492US6552426B2Semiconductor device and method of manufacturing sameSHARP KK·Filed 2001·Granted Apr 22, 2003·78 cites·9 claims
- 0587US5793108ASemiconductor integrated circuit having a plurality of semiconductor chipsSHARP KK·Filed 1996·Granted Aug 11, 1998·97 cites·16 claims
- 0686US8622594B2Light emitting element module and manufacturing method thereof, and backlight apparatusISHIO TOSHIYA·Filed 2010·Granted Jan 7, 2014·10 cites·7 claims
- 0786US7091616B2Semiconductor device having a leading wiring layerSHARP KK·Filed 2002·Granted Aug 15, 2006·42 cites·16 claims
- 0883US6921980B2Integrated semiconductor circuit including electronic component connected between different component connection portionsSHARP KK·Filed 2002·Granted Jul 26, 2005·36 cites·10 claims
- 0983US6104084ASemiconductor device including a wire pattern for relaying connection between a semiconductor chip and leadsSHARP KK·Filed 1998·Granted Aug 15, 2000·82 cites·42 claims
- 1076US7445958B2Semiconductor device having a leading wiring layerSHARP KK·Filed 2006·Granted Nov 4, 2008·6 cites·17 claims
- 1168US7906856B2Semiconductor device and method for manufacturing semiconductor deviceSHARP KK·Filed 2008·Granted Mar 15, 2011·4 cites·7 claims
- 1261US6940175B2Semiconductor device in which a plurality of electronic components are combined with each otherSHARP KK·Filed 2002·Granted Sep 6, 2005·9 cites·10 claims
- 1358US8297784B2Surface-emission unit and method for producing the sameISHIO TOSHIYA·Filed 2010·Granted Oct 30, 2012·1 cites·10 claims
- 1453US6396157B2Semiconductor integrated circuit device and manufacturing method thereofSHARP KK·Filed 2001·Granted May 28, 2002·6 cites·6 claims
- 1551US11239395B2Image display deviceSHARP KK·Filed 2020·Granted Feb 1, 2022·0 cites·11 claims
- 1649US2008150096A1Multi-chip module, manufacturing method thereof, mounting structure of multi-chip module, and manufacturing method of mounting structureSHARP KK·Filed 2007·Application pending·0 cites
- 1748US10861813B2Semiconductor chip stack and method for manufacturing semiconductor chip stackSHARP KK·Filed 2019·Granted Dec 8, 2020·0 cites·12 claims
- 1848US2021135064A1Display device and manufacturing method of display deviceSHARP FUKUYAMA SEMICONDUCTOR CO LTD·Filed 2020·Application pending·0 cites
- 1947US2021005520A1Method and apparatus for manufacturing array deviceSHARP KK·Filed 2020·Application pending·0 cites
- 2044US6784528B2Semiconductor device with plating wiring connecting IC electrode pad to terminalSHARP KK·Filed 2002·Granted Aug 31, 2004·1 cites·9 claims
- 2141US2002014705A1Semiconductor device and manufacturing method of sameFiled 2001·Application pending·0 cites
- 2241US2005104165A1Semiconductor element, semiconductor device, and method for manufacturing semiconductor elementSHARP KK·Filed 2004·Application pending·0 cites
- 2336US6831002B2Manufacturing method of semiconductor deviceSHARP KK·Filed 2002·Granted Dec 14, 2004·0 cites·23 claims
- 2429US2001013643A1Semiconductor integrated circuit deviceFiled 1999·Application pending·0 cites
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