Inventor · disambiguated record
Ed C. Lee
Also filed as: LEE ED · LEE ED C
15 granted patents·3 pending applications·271 citations·filing 1984–2015
94Inventor score
Files withASML HOLDING NV7SILICON VALLEY GROUP4ASML HOLDINGS N V1ASML NETHERLANDS BV1BECTON DICKINSON CO1
Top patents by PatentIndex Score
18 records- 0193US6905547B1Method and apparatus for flexible atomic layer depositionGENUS INC·Filed 2002·Granted Jun 14, 2005·78 cites·74 claims
- 0282US6669779B2Yield and line width performance for liquid polymers and other materialsASML HOLDING NV·Filed 2001·Granted Dec 30, 2003·14 cites·14 claims
- 0381US6468586B1Environment exchange control for material on a wafer surfaceSILICON VALLEY GROUP·Filed 2000·Granted Oct 22, 2002·15 cites·12 claims
- 0480US6254936B1Environment exchange control for material on a wafer surfaceSILICON VALLEY GROUP·Filed 1998·Granted Jul 3, 2001·33 cites·22 claims
- 0579US6844027B1Environment exchange control for material on a wafer surfaceASML HOLDING NV·Filed 2000·Granted Jan 18, 2005·13 cites·7 claims
- 0676US6780461B2Environment exchange control for material on a wafer surfaceASML HOLDING NV·Filed 2001·Granted Aug 24, 2004·16 cites·5 claims
- 0776US4566026AIntegrated circuit bimetal layerHONEYWELL INC·Filed 1984·Granted Jan 21, 1986·37 cites·25 claims
- 0873US6977098B2Method of uniformly coating a substrateASML HOLDING NV·Filed 2001·Granted Dec 20, 2005·17 cites·5 claims
- 0969US7208262B2Yield and line width performance for liquid polymers and other materialsASML HOLDINGS N V·Filed 2004·Granted Apr 24, 2007·6 cites·5 claims
- 1066US6911091B2Environment exchange control for material on a wafer surfaceASML NETHERLANDS BV·Filed 2002·Granted Jun 28, 2005·6 cites·35 claims
- 1166US6248171B1Yield and line width performance for liquid polymers and other materialsSILICON VALLEY GROUP·Filed 1998·Granted Jun 19, 2001·20 cites·4 claims
- 1257US7625692B2Yield and line width performance for liquid polymers and other materialsASML HOLDING NV·Filed 2006·Granted Dec 1, 2009·0 cites·6 claims
- 1355US7255975B2Yield and line width performance for liquid polymers and other materialsASML HOLDING NV·Filed 2003·Granted Aug 14, 2007·3 cites·20 claims
- 1452US2007089671A1Yield and line width performance for liquid polymers and other materialsGURER EMIR·Filed 2006·Application pending·0 cites
- 1550US6242364B1Plasma deposition of spin chucks to reduce contamination of silicon wafersSILICON VALLEY GROUP·Filed 1999·Granted Jun 5, 2001·11 cites·11 claims
- 1647US2009043242A1Instruments and methods for implanting corneal implant via extra-and intra-cameral routesBECTON DICKINSON CO·Filed 2007·Application pending·0 cites
- 1745US2015332295A1Method of Forecasting Resource DemandMASTERCARD INTERNATIONAL INC·Filed 2015·Application pending·0 cites
- 1837US6955720B2Plasma deposition of spin chucks to reduce contamination of Silicon wafersASML HOLDING NV·Filed 2001·Granted Oct 18, 2005·2 cites·11 claims
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