Inventor · disambiguated record
Mark J. Jeanson
Also filed as: JEANSON MARK · JEANSON MARK J · JEANSON MARK JAMES
47 granted patents·3 pending applications·96 citations·filing 2003–2022
97Inventor score
Top patents by PatentIndex Score
50 records- 0196US10048312B1Testing printed circuit board assemblyIBM·Filed 2017·Granted Aug 14, 2018·9 cites·1 claims
- 0287US11619665B2Electrical apparatus having tin whisker sensing and preventionIBM·Filed 2020·Granted Apr 4, 2023·2 cites·20 claims
- 0386US10318462B2Secure crypto module including optical glass security layerIBM·Filed 2016·Granted Jun 11, 2019·4 cites·16 claims
- 0485US11812562B2Creating a standoff for a low-profile component without adding a process stepIBM·Filed 2021·Granted Nov 7, 2023·1 cites·15 claims
- 0584US10168383B2Testing printed circuit board assemblyIBM·Filed 2017·Granted Jan 1, 2019·2 cites·20 claims
- 0683US7317401B2Method and mechanical tamper-evident case fastenerIBM·Filed 2005·Granted Jan 8, 2008·12 cites·20 claims
- 0782US10157527B1Embossed printed circuit board for intrusion detectionIBM·Filed 2017·Granted Dec 18, 2018·3 cites·18 claims
- 0880US10025751B2Dynamic clock lane assignment for increased performance and securityIBM·Filed 2016·Granted Jul 17, 2018·2 cites·13 claims
- 0979US10481496B2Forming conductive vias using a light guideIBM·Filed 2017·Granted Nov 19, 2019·2 cites·21 claims
- 1074US10679926B2Method of making integrated die paddle structures for bottom terminated componentsIBM·Filed 2017·Granted Jun 9, 2020·1 cites·11 claims
- 1174US8491739B2Implementing interleaved-dielectric joining of multi-layer laminatesGERMANN PHILIP R·Filed 2010·Granted Jul 23, 2013·3 cites·9 claims
- 1274US8412974B2Global synchronization of parallel processors using clock pulse width modulationCHEN DONG·Filed 2010·Granted Apr 2, 2013·4 cites·21 claims
- 1370US7080763B2Carrying strap for notebook computerIBM·Filed 2003·Granted Jul 25, 2006·16 cites·9 claims
- 1468US11864327B2Creating inductors, resistors, capacitors and other structures in printed circuit board vias with light pipe technologyIBM·Filed 2020·Granted Jan 2, 2024·0 cites·11 claims
- 1568US10670964B2Ruggedized solder mask materialIBM·Filed 2017·Granted Jun 2, 2020·0 cites·20 claims
- 1667US12174241B2Apparatus and method for tin whisker isolation and detectionIBM·Filed 2022·Granted Dec 24, 2024·0 cites·20 claims
- 1767US8788879B2Non-volatile memory for checkpoint storageBLUMRICH MATTHIAS A·Filed 2011·Granted Jul 22, 2014·2 cites·22 claims
- 1867US8340152B2Spread spectrum clocking with transmitted modulationJEANSON MARK JAMES·Filed 2008·Granted Dec 25, 2012·5 cites·6 claims
- 1967US8108823B2User selected grid for logically representing an electronic circuitALLEN JONATHAN M·Filed 2008·Granted Jan 31, 2012·7 cites·20 claims
- 2065US11652034B2Direct current blocking capacitors and method of attaching an IC package to a PCBIBM·Filed 2020·Granted May 16, 2023·0 cites·13 claims
- 2165US10834828B2Creating inductors, resistors, capacitors and other structures in printed circuit board vias with light pipe technologyIBM·Filed 2018·Granted Nov 10, 2020·0 cites·20 claims
- 2264US11614497B2Leakage characterization for electronic circuit temperature monitoringIBM·Filed 2019·Granted Mar 28, 2023·0 cites·12 claims
- 2364US10712664B2Forming conductive vias using a light guideIBM·Filed 2019·Granted Jul 14, 2020·0 cites·20 claims
- 2464US10433431B2Implementing customized PCB via creation through use of magnetic padsIBM·Filed 2019·Granted Oct 1, 2019·0 cites·13 claims
- 2564US6953897B2Device and method for clamping and grounding a cableIBM·Filed 2003·Granted Oct 11, 2005·13 cites·25 claims
- 2661US12079377B2X-ray sensitive materials for data protectionIBM·Filed 2021·Granted Sep 3, 2024·0 cites·20 claims
- 2761US10739679B2Ruggedized solder mask materialIBM·Filed 2019·Granted Aug 11, 2020·0 cites·20 claims
- 2861US10055380B2Dynamic clock lane assignment for increased performance and securityIBM·Filed 2018·Granted Aug 21, 2018·0 cites·20 claims
- 2959US10342142B2Implementing customized PCB via creation through use of magnetic padsIBM·Filed 2017·Granted Jul 2, 2019·0 cites·6 claims
- 3059US7326857B2Method and structure for creating printed circuit boards with stepped thicknessIBM·Filed 2004·Granted Feb 5, 2008·7 cites·6 claims
- 3158US10559522B2Integrated die paddle structures for bottom terminated componentsIBM·Filed 2018·Granted Feb 11, 2020·0 cites·6 claims
- 3258US10303639B2Secure crypto module including optical glass security layerIBM·Filed 2018·Granted May 28, 2019·0 cites·6 claims
- 3357US11080222B2Secure crypto module including optical glass security layerIBM·Filed 2018·Granted Aug 3, 2021·0 cites·16 claims
- 3457US10955568B2X-ray sensitive device to detect an inspectionIBM·Filed 2019·Granted Mar 23, 2021·0 cites·19 claims
- 3557US9515401B1Elastomeric electrical connector structure joining two hardware planes at right angles to each otherIBM·Filed 2016·Granted Dec 6, 2016·1 cites·16 claims
- 3656US10715337B2Secure crypto module including conductor on glass security layerIBM·Filed 2017·Granted Jul 14, 2020·0 cites·16 claims
- 3756US9965438B2Dynamic clock lane assignment for increased performance and securityIBM·Filed 2015·Granted May 8, 2018·0 cites·7 claims
- 3856US2013221068A1Implementing interleaved-dielectric joining of multi-layer laminatesIBM·Filed 2013·Application pending·0 cites
- 3955US10834830B2Creating in-via routing with a light pipeIBM·Filed 2019·Granted Nov 10, 2020·0 cites·7 claims
- 4054US10916493B2Direct current blocking capacitorsIBM·Filed 2018·Granted Feb 9, 2021·0 cites·6 claims
- 4153US11177595B2Electrical connection management using a cardIBM·Filed 2019·Granted Nov 16, 2021·0 cites·6 claims
- 4253US10083894B2Integrated die paddle structures for bottom terminated componentsIBM·Filed 2015·Granted Sep 25, 2018·0 cites·8 claims
- 4353US9887847B2Secure crypto module including conductor on glass security layerIBM·Filed 2016·Granted Feb 6, 2018·0 cites·16 claims
- 4449US11134562B2Chip interconnect devicesIBM·Filed 2019·Granted Sep 28, 2021·0 cites·20 claims
- 4549US10548216B2Employing conductive track writing in a tamper-respondent systemIBM·Filed 2017·Granted Jan 28, 2020·0 cites·17 claims
- 4648US10622316B2Security arrangement for integrated circuits using microcapsules in dielectric layerIBM·Filed 2017·Granted Apr 14, 2020·0 cites·18 claims
- 4747US10559902B2Electrical connection management using a cardIBM·Filed 2016·Granted Feb 11, 2020·0 cites·18 claims
- 4847US10169623B2Security apparatus for computing systemsIBM·Filed 2016·Granted Jan 1, 2019·0 cites·20 claims
- 4945US2009056350A1Bimetallic heat sink air deflectors for directed airflow for improved thermal transfer and dissipationIBM·Filed 2007·Application pending·0 cites
- 5044US2010061424A1Spread Spectrum Controller with Bit Error Rate FeedbackIBM·Filed 2008·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →