Inventor · disambiguated record
Yasuhiro Usui
Also filed as: USUI YASUHIRO
5 granted patents·2 pending applications·23 citations·filing 1999–2017
75Inventor score
Files withFUJITSU LTD7
Top patents by PatentIndex Score
7 records- 0166US7268002B2Packaging method, packaging structure and package substrate for electronic partsFUJITSU LTD·Filed 2005·Granted Sep 11, 2007·3 cites·9 claims
- 0250US10408756B2Analysis method and analysis apparatusFUJITSU LTD·Filed 2017·Granted Sep 10, 2019·0 cites·14 claims
- 0349US7291901B2Packaging method, packaging structure and package substrate for electronic partsFUJITSU LTD·Filed 2004·Granted Nov 6, 2007·3 cites·9 claims
- 0447US6869822B2Method of making a semiconductor device with adhesive sealing subjected to two-fold hardeningFUJITSU LTD·Filed 2002·Granted Mar 22, 2005·3 cites·13 claims
- 0546US6057168AMethod for forming bumps using dummy waferFUJITSU LTD·Filed 1999·Granted May 2, 2000·14 cites·9 claims
- 0640US2005110169A1Semiconductor device and method of making the sameFUJITSU LTD·Filed 2004·Application pending·0 cites
- 0739US2006215810A1Fluorescent X-ray analyzer, fluorescent X-ray analysis method, and fluorescent X-ray analysis programFUJITSU LTD·Filed 2005·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →