Inventor · disambiguated record
Uihyoung Lee
Also filed as: LEE UIHYOUNG
7 granted patents·5 pending applications·11 citations·filing 2009–2025
76Inventor score
Top patents by PatentIndex Score
12 records- 0191US11871563B2Method of forming contact included in semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 9, 2024·2 cites·20 claims
- 0276US2025352949A1Apparatus and method of trapping an exhaust material from a substrate-processing process and apparatus for processing a substrate including the trapping apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0375US12238923B2Method of forming contact included in semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Feb 25, 2025·0 cites·10 claims
- 0471US8129840B2Semiconductor package and methods of manufacturing the sameJO CHAJEA·Filed 2009·Granted Mar 6, 2012·8 cites·19 claims
- 0571US2025118600A1Methods of fabricating semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0669US12247290B2Flow control method using plasma systemSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Mar 11, 2025·0 cites·20 claims
- 0764US9812331B2Apparatus for and method of processing substrateSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Nov 7, 2017·1 cites·14 claims
- 0862US12390763B2Apparatus trapping an exhaust material from a substrate-processing process and apparatus for processing a substrate including the trapping apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 19, 2025·0 cites·18 claims
- 0959US12211745B2Methods of fabricating semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 28, 2025·0 cites·19 claims
- 1058US2025079238A1Method of fabricating a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1138US2011108415A1Apparatus and method for plating a substrateLEE UIHYOUNG·Filed 2010·Application pending·0 cites
- 1236US2011226626A1Apparatus and method for treating substrateSAMSUNG ELECTRONICS CO LTD·Filed 2011·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →