Inventor · disambiguated record
Seijiro Sunaga
Also filed as: SUNAGA SEIJIRO
5 granted patents·2 pending applications·2 citations·filing 2019–2023
63Inventor score
Files withTDK CORP7
Top patents by PatentIndex Score
7 records- 0169US11167541B2Apparatus for manufacturing element array and apparatus for removing specific elementTDK CORP·Filed 2019·Granted Nov 9, 2021·1 cites·18 claims
- 0262US11267071B2Ultrasonic bonding head, ultrasonic bonding device, and ultrasonic bonding methodTDK CORP·Filed 2019·Granted Mar 8, 2022·1 cites·10 claims
- 0358US12406866B2Stamp tool, transfer device, and element array manufacturing methodTDK CORP·Filed 2021·Granted Sep 2, 2025·0 cites·19 claims
- 0455US2023381904A1Substrate processing apparatusTDK CORP·Filed 2023·Application pending·0 cites
- 0554US11101317B2Method of manufacturing element array and method of removing specific elementTDK CORP·Filed 2019·Granted Aug 24, 2021·0 cites·17 claims
- 0647US2023093241A1Element array pressurizing device, manufacturing device, and manufacturing methodTDK CORP·Filed 2021·Application pending·0 cites
- 0742US11541477B2Ultrasonic bonding device and ultrasonic bonding methodTDK CORP·Filed 2019·Granted Jan 3, 2023·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →