Inventor · disambiguated record
Hajime Karasawa
Also filed as: KARASAWA HAJIME
24 granted patents·2 pending applications·87 citations·filing 1995–2025
96Inventor score
Files withHITACHI INT ELECTRIC INC16HITACHI-KOKUSAI ELECTRIC INC4KOKUSAI ELECTRIC CORP2TAKASAWA YUSHIN2KOKUSAI ELECTRIC CO LTD1
Top patents by PatentIndex Score
26 records- 0196US10026607B2Substrate processing apparatus for forming film including at least two different elementsHITACHI INT ELECTRIC INC·Filed 2016·Granted Jul 17, 2018·8 cites·21 claims
- 0294US9443720B2Method of manufacturing semiconductor device for forming film including at least two different elementsHITACHI-KOKUSAI ELECTRIC INC·Filed 2016·Granted Sep 13, 2016·6 cites·18 claims
- 0394US9385013B2Method and apparatus of manufacturing a semiconductor device by forming a film on a substrateHITACHI INT ELECTRIC INC·Filed 2016·Granted Jul 5, 2016·5 cites·9 claims
- 0494US9312123B2Method of manufacturing semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2015·Granted Apr 12, 2016·6 cites·9 claims
- 0593US9384972B2Method of manufacturing semiconductor device by forming a film on a substrateHITACHI INT ELECTRIC INC·Filed 2015·Granted Jul 5, 2016·5 cites·13 claims
- 0693US9384968B2Method of manufacturing a semiconductor device by forming a film on a substrateHITACHI INT ELECTRIC INC·Filed 2015·Granted Jul 5, 2016·5 cites·15 claims
- 0793US9384971B2Method of manufacturing semiconductor device by forming a film on a substrateHITACHI INT ELECTRIC INC·Filed 2015·Granted Jul 5, 2016·5 cites·14 claims
- 0893US9330904B2Method of manufacturing semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2015·Granted May 3, 2016·5 cites·15 claims
- 0992US9487861B2Substrate processing apparatus capable of forming films including at least two different elementsHITACHI-KOKUSAI ELECTRIC INC·Filed 2016·Granted Nov 8, 2016·4 cites·9 claims
- 1091US9478417B2Method of manufacturing semiconductor device for forming film including at least two different elementsHITACHI-KOKUSAI ELECTRIC INC·Filed 2016·Granted Oct 25, 2016·4 cites·18 claims
- 1191US9443719B2Method of manufacturing semiconductor device for forming film including at least two different elementsHITACHI-KOKUSAI ELECTRIC INC·Filed 2016·Granted Sep 13, 2016·4 cites·9 claims
- 1289US9318316B2Method of manufacturing semiconductor device, method of processing substrate and substrate processing apparatus for forming thin film containing at least two different elementsTAKASAWA YUSHIN·Filed 2009·Granted Apr 19, 2016·7 cites·16 claims
- 1387US9384969B2Method of manufacturing semiconductor device by forming a film on a substrateHITACHI INT ELECTRIC INC·Filed 2015·Granted Jul 5, 2016·2 cites·14 claims
- 1487US9384970B2Method of manufacturing semiconductor device by forming a film on a substrateHITACHI INT ELECTRIC INC·Filed 2015·Granted Jul 5, 2016·2 cites·15 claims
- 1587US9384966B2Method of manufacturing a semiconductor device by forming a film on a substrateHITACHI INT ELECTRIC INC·Filed 2015·Granted Jul 5, 2016·2 cites·13 claims
- 1686US9384967B2Method of manufacturing a semiconductor device by forming a film on a substrateHITACHI INT ELECTRIC INC·Filed 2015·Granted Jul 5, 2016·2 cites·17 claims
- 1778US8409988B2Method of manufacturing semiconductor device and substrate processing apparatusTAKASAWA YUSHIN·Filed 2011·Granted Apr 2, 2013·4 cites·12 claims
- 1866US2017200599A1Method of manufacturing semiconductor device and substrate processing apparatus for forming film including at least two different elementsHITACHI INT ELECTRIC INC·Filed 2017·Application pending·0 cites
- 1957US2025223690A1Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 2049US6943089B2Semiconductor device manufacturing method and semiconductor manufacturing apparatusKOKUSAI ELECTRIC CO LTD·Filed 2001·Granted Sep 13, 2005·4 cites·15 claims
- 2146US10199219B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2017·Granted Feb 5, 2019·0 cites·13 claims
- 2245US10032630B1Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2017·Granted Jul 24, 2018·0 cites·14 claims
- 2345US6821871B2Method for manufacturing semiconductor device, substrate treatment method, and semiconductor manufacturing apparatusHITACHI INT ELECTRIC INC·Filed 2001·Granted Nov 23, 2004·1 cites·12 claims
- 2442US12217959B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2018·Granted Feb 4, 2025·0 cites·8 claims
- 2541US10720324B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2017·Granted Jul 21, 2020·0 cites·15 claims
- 2634US5473774AMethod for conflict detection in parallel processing systemTEXAS INSTRUMENTS INC·Filed 1995·Granted Dec 5, 1995·6 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →