Inventor · disambiguated record
Chien-Chuan Wei
Also filed as: WEI CHIEN-CHUAN
25 granted patents·3 pending applications·123 citations·filing 2008–2016
95Inventor score
Top patents by PatentIndex Score
28 records- 0196US9768144B2Package assembly including a semiconductor substrate in which a first portion of a surface of the semiconductor substrate is recessed relative to a second portion of the surface of the semiconductor substrate to form a recessed region in the semiconductor substrateMARVELL WORLD TRADE LTD·Filed 2016·Granted Sep 19, 2017·11 cites·19 claims
- 0291US8030128B1Method to form high density phase change memory (PCM) top contact every two bitsMARVELL INT LTD·Filed 2008·Granted Oct 4, 2011·21 cites·22 claims
- 0390US7704875B1High-density contact holesMARVELL INT LTD·Filed 2008·Granted Apr 27, 2010·11 cites·22 claims
- 0489US9275929B2Package assembly having a semiconductor substrateMARVELL WORLD TRADE LTD·Filed 2015·Granted Mar 1, 2016·6 cites·20 claims
- 0588US7939445B1High density via and metal interconnect structures, and methods of forming the sameMARVELL INT LTD·Filed 2008·Granted May 10, 2011·17 cites·21 claims
- 0686US8999786B1Reducing source contact to gate spacing to decrease transistor pitchWU ALBERT·Filed 2008·Granted Apr 7, 2015·9 cites·20 claims
- 0782US7745809B1Ultra high density phase change memory having improved emitter contacts, improved GST cell reliability and highly matched UHD GST cells using column mirco-trench stripsMARVELL INT LTD·Filed 2008·Granted Jun 29, 2010·9 cites·19 claims
- 0880US8368214B2Alpha shielding techniques and configurationsMARVELL WORLD TRADE LTD·Filed 2009·Granted Feb 5, 2013·8 cites·10 claims
- 0979US7834341B2Phase change material (PCM) memory devices with bipolar junction transistors and methods for making thereofMARVELL WORLD TRADE LTD·Filed 2008·Granted Nov 16, 2010·9 cites·17 claims
- 1077US7888166B2Method to form high efficiency GST cell using a double heater cutMARVELL WORLD TRADE LTD·Filed 2010·Granted Feb 15, 2011·3 cites·9 claims
- 1174US9257410B2Package assembly including a semiconductor substrate in which a first portion of a surface of the semiconductor substrate is recessed relative to a second portion of the surface of the semiconductor substrate to form a recessed region in the semiconductor substrateWU ALBERT·Filed 2011·Granted Feb 9, 2016·2 cites·26 claims
- 1274US7709835B2Method to form high efficiency GST cell using a double heater cutMARVELL WORLD TRADE LTD·Filed 2008·Granted May 4, 2010·3 cites·7 claims
- 1372US7807539B1Ion implantation and process sequence to form smaller base pick-upMARVELL INT LTD·Filed 2008·Granted Oct 5, 2010·4 cites·10 claims
- 1470US7985616B1Methods to form wide heater trenches and to form memory cells to engage heatersMARVELL INT LTD·Filed 2008·Granted Jul 26, 2011·3 cites·11 claims
- 1569US8501619B1Methods for forming a plurality of contact holes in a microelectronic deviceWU ALBERT·Filed 2011·Granted Aug 6, 2013·1 cites·19 claims
- 1668US9245961B1Reducing source contact to gate spacing to decrease transistor pitchMARVELL INT LTD·Filed 2015·Granted Jan 26, 2016·1 cites·20 claims
- 1767US7863709B1Low base resistance bipolar junction transistor arrayMARVELL INT LTD·Filed 2008·Granted Jan 4, 2011·2 cites·15 claims
- 1864US7994052B1High-density patterningMARVELL INT LTD·Filed 2008·Granted Aug 9, 2011·2 cites·17 claims
- 1961US7939414B1Ion implantation and process sequence to form smaller base pick-upMARVELL INT LTD·Filed 2010·Granted May 10, 2011·1 cites·8 claims
- 2058US8753976B1Methods and apparatus for etching photo-resist material through multiple exposures of the photo-resist materialMARVELL INT LTD·Filed 2013·Granted Jun 17, 2014·0 cites·20 claims
- 2157US2014124961A1Techniques and configurations for recessed semiconductor substratesMARVELL WORLD TRADE LTD·Filed 2014·Application pending·0 cites
- 2255US9391045B2Recessed semiconductor substrates and associated techniquesMARVELL WORLD TRADE LTD·Filed 2015·Granted Jul 12, 2016·0 cites·20 claims
- 2353US8003523B1Methods for forming a plurality of contact holes in a microelectric deviceMARVELL INT LTD·Filed 2010·Granted Aug 23, 2011·0 cites·10 claims
- 2452US9034730B2Recessed semiconductor substrates and associated techniquesWU ALBERT·Filed 2011·Granted May 19, 2015·0 cites·23 claims
- 2551US8603861B2Alpha shielding techniques and configurationsMARVELL WORLD TRADE LTD·Filed 2013·Granted Dec 10, 2013·0 cites·16 claims
- 2651US2011186960A1Techniques and configurations for recessed semiconductor substratesWU ALBERT·Filed 2011·Application pending·0 cites
- 2747US8609528B1High-density patterningSUTARDJA PANTAS·Filed 2011·Granted Dec 17, 2013·0 cites·10 claims
- 2846US2011175218A1Package assembly having a semiconductor substrateLIOU SHIANN-MING·Filed 2010·Application pending·0 cites
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