Inventor · disambiguated record
Jerzy M. Zalesinski
Also filed as: ZALESINSKI JERZY · ZALESINSKI JERZY M · ZALESINSKI JERZY MARIA
35 granted patents·2,761 citations·filing 1990–2006
98Inventor score
Files withIBM35
Top patents by PatentIndex Score
35 records- 0198US6358627B2Rolling ball connectorIBM·Filed 2001·Granted Mar 19, 2002·164 cites·7 claims
- 0298US6236115B1High density integrated circuit packaging with chip stacking and via interconnectionsIBM·Filed 1999·Granted May 22, 2001·342 cites·3 claims
- 0398US6187678B1High density integrated circuit packaging with chip stacking and via interconnectionsIBM·Filed 1999·Granted Feb 13, 2001·274 cites·16 claims
- 0498US6002177AHigh density integrated circuit packaging with chip stacking and via interconnectionsIBM·Filed 1995·Granted Dec 14, 1999·408 cites·20 claims
- 0597US6410431B2Through-chip conductors for low inductance chip-to-chip integration and off-chip connectionsIBM·Filed 2000·Granted Jun 25, 2002·127 cites·6 claims
- 0693US6177729B1Rolling ball connectorIBM·Filed 1999·Granted Jan 23, 2001·84 cites·23 claims
- 0790US7394268B2Carrier for test, burn-in, and first level packagingIBM·Filed 2006·Granted Jul 1, 2008·13 cites·4 claims
- 0890US6388198B1Coaxial wiring within SOI semiconductor, PCB to system for high speed operation and signal qualityIBM·Filed 1999·Granted May 14, 2002·95 cites·13 claims
- 0989US7132841B1Carrier for test, burn-in, and first level packagingIBM·Filed 2000·Granted Nov 7, 2006·37 cites·31 claims
- 1089US6943452B2Coaxial wiring within SOI semiconductor, PCB to system for high speed operation and signal qualityIBM·Filed 2002·Granted Sep 13, 2005·47 cites·4 claims
- 1189US5543585ADirect chip attachment (DCA) with electrically conductive adhesivesIBM·Filed 1994·Granted Aug 6, 1996·103 cites·21 claims
- 1288US6222276B1Through-chip conductors for low inductance chip-to-chip integration and off-chip connectionsIBM·Filed 1998·Granted Apr 24, 2001·82 cites·14 claims
- 1387US6025992AIntegrated heat exchanger for memory moduleIBM·Filed 1999·Granted Feb 15, 2000·139 cites·8 claims
- 1487US5773362AMethod of manufacturing an integrated ULSI heatsinkIBM·Filed 1997·Granted Jun 30, 1998·74 cites·18 claims
- 1587US5545465ACircuit board having a defined volume of solder or conductive adhesive deposited at interconnection sites for electrical circuitsIBM·Filed 1995·Granted Aug 13, 1996·71 cites·17 claims
- 1686US5565033APressurized injection nozzle for screening pasteIBM·Filed 1995·Granted Oct 15, 1996·67 cites·10 claims
- 1785US6212076B1Enhanced heat-dissipating printed circuit board packageIBM·Filed 1999·Granted Apr 3, 2001·61 cites·29 claims
- 1885US5747101ADirect chip attachment (DCA) with electrically conductive adhesivesIBM·Filed 1996·Granted May 5, 1998·72 cites·15 claims
- 1985US5733466AElectrolytic method of depositing gold connectors on a printed circuit boardIBM·Filed 1996·Granted Mar 31, 1998·79 cites·11 claims
- 2085US5478700AMethod for applying bonding agents to pad and/or interconnection sites in the manufacture of electrical circuits using a bonding agent injection headIBM·Filed 1993·Granted Dec 26, 1995·65 cites·21 claims
- 2184US6319745B1Formation of charge-coupled-device with image pick-up arrayIBM·Filed 2000·Granted Nov 20, 2001·38 cites·20 claims
- 2278US5759269AManufacturing flexible circuit board assemblies and printer for screening solder paste in such manufactureIBM·Filed 1995·Granted Jun 2, 1998·41 cites·4 claims
- 2377US5729052AIntegrated ULSI heatsinkIBM·Filed 1996·Granted Mar 17, 1998·43 cites·6 claims
- 2477US5638597AManufacturing flexible circuit board assemblies with common heat spreadersIBM·Filed 1995·Granted Jun 17, 1997·42 cites·23 claims
- 2575US6793500B1Radial contact pad footprint and wiring for electrical componentsIBM·Filed 2003·Granted Sep 21, 2004·20 cites·17 claims
- 2675US5663806ANon-destructive target marking for image stitchingIBM·Filed 1995·Granted Sep 2, 1997·47 cites·10 claims
- 2773US5969945AElectronic package assemblyIBM·Filed 1997·Granted Oct 19, 1999·33 cites·4 claims
- 2871US5831828AFlexible circuit board and common heat spreader assemblyIBM·Filed 1993·Granted Nov 3, 1998·32 cites·15 claims
- 2960US6816374B2High efficiency heat sink/air cooler system for heat-generating componentsIBM·Filed 2003·Granted Nov 9, 2004·9 cites·20 claims
- 3049US5567984AProcess for fabricating an electronic circuit packageIBM·Filed 1995·Granted Oct 22, 1996·15 cites·12 claims
- 3146US5499162AUniversal frame for data cardIBM·Filed 1994·Granted Mar 12, 1996·17 cites·10 claims
- 3242US6255208B1Selective wafer-level testing and burn-inIBM·Filed 1999·Granted Jul 3, 2001·10 cites·18 claims
- 3340US7196908B2Dual pitch contact pad footprint for flip-chip chips and modulesIBM·Filed 2003·Granted Mar 27, 2007·0 cites·20 claims
- 3435US5050296AAffixing pluggable pins to a ceramic substrateIBM·Filed 1990·Granted Sep 24, 1991·10 cites·7 claims
- 3534US6541837B2Charge-coupled device wafer cover plate with compact interconnect wiringIBM·Filed 2001·Granted Apr 1, 2003·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →