Inventor · disambiguated record
Pei-Jen Lo
Also filed as: LO PEI-JEN
9 granted patents·1 pending application·0 citations·filing 2018–2023
74Inventor score
Technology areasH10W
Files withADVANCED SEMICONDUCTOR ENG10
Top patents by PatentIndex Score
10 records- 0172US12300651B2Electronic device, package structure and electronic manufacturing methodADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted May 13, 2025·0 cites·14 claims
- 0264US11715716B2Electronic device, package structure and electronic manufacturing methodADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Aug 1, 2023·0 cites·16 claims
- 0355US11978706B2Electronic package structure, electronic substrate and method of manufacturing electronic package structureADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted May 7, 2024·0 cites·11 claims
- 0452US11538756B2Bonding structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Dec 27, 2022·0 cites·16 claims
- 0549US11594506B2Semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Feb 28, 2023·0 cites·17 claims
- 0644US11011491B2Semiconductor device packages and methods of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted May 18, 2021·0 cites·27 claims
- 0742US2021320038A1Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2020·Application pending·0 cites
- 0840US11120988B2Semiconductor device packages and methods of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Sep 14, 2021·0 cites·16 claims
- 0939US11031382B2Passive element, electronic device and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Jun 8, 2021·0 cites·17 claims
- 1030US11393776B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Jul 19, 2022·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →