Inventor · disambiguated record
Richard Emery
Also filed as: EMERY RICHARD D
4 granted patents·2 pending applications·36 citations·filing 2003–2006
72Inventor score
Top patents by PatentIndex Score
6 records- 0176US7095111B2Package with integrated wick layer and method for heat removalINTEL CORP·Filed 2003·Granted Aug 22, 2006·25 cites·19 claims
- 0252US7091108B2Methods and apparatuses for manufacturing ultra thin device layers for integrated circuit devicesINTEL CORP·Filed 2003·Granted Aug 15, 2006·9 cites·7 claims
- 0347US7531429B2Methods and apparatuses for manufacturing ultra thin device layers for integrated circuit devicesINTEL CORP·Filed 2006·Granted May 12, 2009·2 cites·13 claims
- 0437US2007004216A1Formation of assemblies with a diamond heat spreaderHU CHUAN·Filed 2005·Application pending·0 cites
- 0537US2005277281A1Compliant interconnect and method of formationDUBIN VALERY M·Filed 2004·Application pending·0 cites
- 0634US7952190B2Fabrication of microelectronic devicesINTEL CORP·Filed 2003·Granted May 31, 2011·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →