Inventor · disambiguated record
Keigo Obata
Also filed as: OBATA KEIGO
17 granted patents·4 pending applications·576 citations·filing 1976–2023
95Inventor score
Files withDAIWA FINE CHEMICALS CO LTD8HARIMA CHEMICALS INC3ISHIHARA CHEMICAL CO LTD2NIPPON PAINT AUTOMOTIVE COATINGS CO LTD2HYOGO PREFECTURAL GOVERNMENT1
Top patents by PatentIndex Score
21 records- 0196US7628903B1Silver and silver alloy plating bathISHIHARA CHEMICAL CO LTD·Filed 2000·Granted Dec 8, 2009·70 cites·3 claims
- 0296US6607653B1Plating bath and process for depositing alloy containing tin and copperDAIWA FINE CHEMICALS CO LTD·Filed 2000·Granted Aug 19, 2003·86 cites·15 claims
- 0394US6183545B1Aqueous solutions for obtaining metals by reductive depositionDAIWA FINE CHEMICALS CO LTD·Filed 1999·Granted Feb 6, 2001·142 cites·12 claims
- 0492US4459185ATin, lead, and tin-lead alloy plating bathsOBATA DONI DAIWA FINE CHEMICAL·Filed 1983·Granted Jul 10, 1984·94 cites·26 claims
- 0590US7938948B2Silver and silver alloy plating bathISHIHARA CHEMICAL CO LTD·Filed 2009·Granted May 10, 2011·6 cites·10 claims
- 0687US4132610AMethod of bright electroplating of tin-lead alloyHYOGO PREFECTURAL GOVERNMENT·Filed 1976·Granted Jan 2, 1979·30 cites·1 claims
- 0782US6338787B1Redox system electroless plating methodDAIWA FINE CHEMICALS CO LTD·Filed 2000·Granted Jan 15, 2002·25 cites·13 claims
- 0878US2024084164A1Cationic electrodeposition coating composition and method for forming cured electrodeposition coating filmNIPPON PAINT AUTOMOTIVE COATINGS CO LTD·Filed 2023·Application pending·0 cites
- 0977US6235093B1Aqueous solutions for obtaining noble metals by chemical reductive depositionDAIWA FINE CHEMICALS CO LTD·Filed 1999·Granted May 22, 2001·47 cites·4 claims
- 1076US6852210B2Plating method and plating bath precursor used thereforDAIWA FINE CHEMICALS CO LTD·Filed 2002·Granted Feb 8, 2005·17 cites·3 claims
- 1174US7669752B2Flux for soldering and circuit boardHARIMA CHEMICALS INC·Filed 2007·Granted Mar 2, 2010·5 cites·19 claims
- 1272US11945962B2Cationic electrodeposition coating composition and method for forming cured electrodeposition coating filmNIPPON PAINT AUTOMOTIVE COATINGS CO LTD·Filed 2019·Granted Apr 2, 2024·0 cites·5 claims
- 1371US7166152B2Pretreatment solution for providing catalyst for electroless plating, pretreatment method using the solution, and electroless plated film and/or plated object produced by use of the methodDAIWA FINE CHEMICALS CO LTD·Filed 2003·Granted Jan 23, 2007·13 cites·27 claims
- 1462US6923875B2Solder precipitating compositionHARIMA CHEMICALS INC·Filed 2003·Granted Aug 2, 2005·8 cites·10 claims
- 1560US7056448B2Method for forming circuit patternDAIWA FINE CHEMICALS CO LTD·Filed 2003·Granted Jun 6, 2006·6 cites·17 claims
- 1658US4992154ABrush for electrolytic treatmentMARUI MEKKI KOGYO YUGEN KAISHA·Filed 1989·Granted Feb 12, 1991·12 cites·6 claims
- 1756US4673470ATin, lead, or tin-lead alloy plating bathOBATA KEIGO·Filed 1986·Granted Jun 16, 1987·12 cites·10 claims
- 1843US2006147683A1Flux for soldering and circuit boardHARIMA CHEMICALS INC·Filed 2004·Application pending·0 cites
- 1937US2003150743A1Tin or tin alloy plating bath, tin salt solution and acid or complexing agent solution for preparing or controlling and making up the plating bath, and electrical and electric components prepared by the use of the plating bathDAIWA FINE CHEMICALS CO LTD·Filed 2002·Application pending·0 cites
- 2030US2006113006A1Tin-containing plating bathMASUDA AKIHIRO·Filed 2004·Application pending·0 cites
- 2129US4555314ATin-lead alloy plating bathOBATA DOHI DAIWA FINE CHEMICAL·Filed 1984·Granted Nov 26, 1985·3 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →