Inventor · disambiguated record
Walter Tony Wohlmuth
Also filed as: WOHLMUTH WALTER · WOHLMUTH WALTER TONY
9 granted patents·9 pending applications·1 citations·filing 2005–2023
74Inventor score
Files withWIN SEMICONDUCTORS CORP10GLOBALWAFERS CO LTD2WOHLMUTH WALTER TONY2MAHONEY GERARD1RENESAS ELECTRONICS AMERICA INC1
Top patents by PatentIndex Score
18 records- 0173US12112985B2Semiconductor substrateGLOBALWAFERS CO LTD·Filed 2023·Granted Oct 8, 2024·0 cites·13 claims
- 0265US11887893B2Semiconductor substrate and method of manufacturing the sameGLOBALWAFERS CO LTD·Filed 2021·Granted Jan 30, 2024·0 cites·20 claims
- 0355US12310105B2Semiconductor device including high electron mobility transistors with an improved backside electrode being applied in a half-bridge circuitVANGUARD INT SEMICONDUCT CORP·Filed 2022·Granted May 20, 2025·0 cites·19 claims
- 0455US12040290B2Radio frequency integrated circuitUNIV NAT TSING HUA·Filed 2021·Granted Jul 16, 2024·0 cites·42 claims
- 0555US9136345B1Method to produce high electron mobility transistors with Boron implanted isolationWIN SEMICONDUCTORS CORP·Filed 2014·Granted Sep 15, 2015·1 cites·19 claims
- 0652US2025211171A1Broadband interstage matchingRENESAS ELECTRONICS AMERICA INC·Filed 2023·Application pending·0 cites
- 0740US11876128B2Field effect transistorWOHLMUTH WALTER TONY·Filed 2021·Granted Jan 16, 2024·0 cites·19 claims
- 0839US11355586B2Heterojuction bipolar transistorWOHLMUTH WALTER TONY·Filed 2020·Granted Jun 7, 2022·0 cites·18 claims
- 0939US2015099358A1Method for forming through wafer vias in semiconductor devicesWIN SEMICONDUCTORS CORP·Filed 2013·Application pending·0 cites
- 1036US2020304089A1Wideband impedance matching networkWIN SEMICONDUCTORS CORP·Filed 2019·Application pending·0 cites
- 1135US10804176B2Low stress moisture resistant structure of semiconductor deviceWIN SEMICONDUCTORS CORP·Filed 2019·Granted Oct 13, 2020·0 cites·67 claims
- 1235US2020303532A1GaN-BASED FIELD EFFECT TRANSISTORWIN SEMICONDUCTORS CORP·Filed 2019·Application pending·0 cites
- 1335US2014283991A1Wafer Edge ProtectorWIN SEMICONDUCTORS CORP·Filed 2013·Application pending·0 cites
- 1435US2015097328A1Wafer holding structureWIN SEMICONDUCTORS CORP·Filed 2013·Application pending·0 cites
- 1534US10374129B2Compound semiconductors having an improved high temperature resistant backside metallizationWIN SEMICONDUCTORS CORP·Filed 2017·Granted Aug 6, 2019·0 cites·15 claims
- 1633US2017222011A1Gate Metal Structure for Compound Semiconductor DevicesWIN SEMICONDUCTORS CORP·Filed 2016·Application pending·0 cites
- 1732US2019148498A1Passivation Structure For GaN Field Effect TransistorWIN SEMICONDUCTORS CORP·Filed 2017·Application pending·0 cites
- 1832US2007023901A1Microelectronic bond padMAHONEY GERARD·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →