Inventor · disambiguated record
Sree Rangasai V. Kesapragada
Also filed as: KESAPRAGADA SREE RANGASAI · KESAPRAGADA SREE RANGASAI V · KESAPRAGADA Sree
12 granted patents·3 pending applications·18 citations·filing 2014–2021
86Inventor score
Files withAPPLIED MATERIALS INC15
Top patents by PatentIndex Score
15 records- 0185US10157787B2Method and apparatus for depositing cobalt in a featureAPPLIED MATERIALS INC·Filed 2016·Granted Dec 18, 2018·4 cites·5 claims
- 0281US10991617B2Methods and apparatus for cleaving of semiconductor substratesAPPLIED MATERIALS INC·Filed 2019·Granted Apr 27, 2021·2 cites·4 claims
- 0381US9601431B2Dielectric/metal barrier integration to prevent copper diffusionAPPLIED MATERIALS INC·Filed 2014·Granted Mar 21, 2017·4 cites·1 claims
- 0478US10109520B2Methods for depositing dielectric barrier layers and aluminum containing etch stop layersAPPLIED MATERIALS INC·Filed 2016·Granted Oct 23, 2018·2 cites·14 claims
- 0576US9984976B2Interconnect structures and methods of formationAPPLIED MATERIALS INC·Filed 2016·Granted May 29, 2018·2 cites·18 claims
- 0676US9299605B2Methods for forming passivation protection for an interconnection structureAPPLIED MATERIALS INC·Filed 2014·Granted Mar 29, 2016·3 cites·20 claims
- 0772US10815561B2Method and apparatus for asymmetric selective physical vapor depositionAPPLIED MATERIALS INC·Filed 2019·Granted Oct 27, 2020·1 cites·20 claims
- 0870US11610807B2Methods and apparatus for cleaving of semiconductor substratesAPPLIED MATERIALS INC·Filed 2021·Granted Mar 21, 2023·0 cites·19 claims
- 0970US11569122B2Methods and apparatus for cleaving of semiconductor substratesAPPLIED MATERIALS INC·Filed 2021·Granted Jan 31, 2023·0 cites·20 claims
- 1059US10707122B2Methods for depositing dielectric barrier layers and aluminum containing etch stop layersAPPLIED MATERIALS INC·Filed 2018·Granted Jul 7, 2020·0 cites·20 claims
- 1156US10714388B2Method and apparatus for depositing cobalt in a featureAPPLIED MATERIALS INC·Filed 2018·Granted Jul 14, 2020·0 cites·13 claims
- 1249US10559578B2Deposition of cobalt films with high deposition rateAPPLIED MATERIALS INC·Filed 2018·Granted Feb 11, 2020·0 cites·20 claims
- 1344US2021123139A1Method and apparatus for low resistance contact interconnectionAPPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
- 1442US2019287772A1Method and apparatus of forming structures by symmetric selective physical vapor depositionAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 1541US2020135464A1Methods and apparatus for patterning substrates using asymmetric physical vapor depositionAPPLIED MATERIALS INC·Filed 2018·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →