Inventor · disambiguated record
Hiroyasu Jobetto
Also filed as: JOBETTO HIROYASU
38 granted patents·4 pending applications·1,030 citations·filing 1994–2011
98Inventor score
Top patents by PatentIndex Score
42 records- 0199US7279750B2Semiconductor device incorporating a semiconductor constructing body and an interconnecting layer which is connected to a ground layer via a vertical conducting portionNIPPON CMK KK·Filed 2005·Granted Oct 9, 2007·86 cites·8 claims
- 0298US8004089B2Semiconductor device having wiring line and manufacturing method thereofCASIO COMPUTER CO LTD·Filed 2009·Granted Aug 23, 2011·68 cites·20 claims
- 0398US7910405B2Semiconductor device having adhesion increasing film to prevent peelingCASIO COMPUTER CO LTD·Filed 2007·Granted Mar 22, 2011·65 cites·9 claims
- 0498US6057647ALight emitting device used for display deviceCASIO COMPUTER CO LTD·Filed 1998·Granted May 2, 2000·251 cites·13 claims
- 0595US7618886B2Semiconductor device and method of manufacturing the sameCASIO COMPUTER CO LTD·Filed 2007·Granted Nov 17, 2009·29 cites·19 claims
- 0695US7489032B2Semiconductor device including a hard sheet to reduce warping of a base plate and method of fabricating the sameCASIO COMPUTER CO LTD·Filed 2004·Granted Feb 10, 2009·89 cites·18 claims
- 0795US7064440B2Semiconductor deviceCASIO COMPUTER CO LTD·Filed 2005·Granted Jun 20, 2006·37 cites·23 claims
- 0893US7547967B2Semiconductor device and method of manufacturing the sameCASIO COMPUTER CO LTD·Filed 2007·Granted Jun 16, 2009·23 cites·20 claims
- 0991US7294922B2Semiconductor device and method of manufacturing the sameCASIO COMPUTER CO LTD·Filed 2004·Granted Nov 13, 2007·51 cites·25 claims
- 1091US7192805B2Semiconductor device and method of manufacturing the sameCASIO COMPUTER CO LTD·Filed 2005·Granted Mar 20, 2007·18 cites·15 claims
- 1190US7737543B2Semiconductor device and method of manufacturing the sameCASIO COMPUTER CO LTD·Filed 2009·Granted Jun 15, 2010·14 cites·8 claims
- 1290US7427812B2Semiconductor device with increased number of external connection electrodesCASIO COMPUTER CO LTD·Filed 2005·Granted Sep 23, 2008·20 cites·18 claims
- 1390US7352054B2Semiconductor device having conducting portion of upper and lower conductive layersCASIO COMPUTER CO LTD·Filed 2005·Granted Apr 1, 2008·18 cites·10 claims
- 1490US7256496B2Semiconductor device having adhesion increasing film to prevent peelingCASIO COMPUTER CO LTD·Filed 2005·Granted Aug 14, 2007·17 cites·11 claims
- 1586USRE43380ESemiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereofWAKISAKA SHINJI·Filed 2010·Granted May 15, 2012·7 cites·47 claims
- 1686US7563640B2Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereofCASIO COMPUTER CO LTD·Filed 2007·Granted Jul 21, 2009·10 cites·11 claims
- 1786US7378645B2Optical sensor module with semiconductor device for driveCASIO COMPUTER CO LTD·Filed 2005·Granted May 27, 2008·13 cites·35 claims
- 1886US7042081B2Semiconductor device having heat dissipation layerCASIO COMPUTER CO LTD·Filed 2004·Granted May 9, 2006·41 cites·20 claims
- 1985US7183639B2Semiconductor device and method of manufacturing the sameNIPPON CMK KK·Filed 2004·Granted Feb 27, 2007·41 cites·36 claims
- 2084US7615411B2Semiconductor package including connected upper and lower interconnections, and manufacturing method thereofCASIO COMPUTER CO LTD·Filed 2008·Granted Nov 10, 2009·10 cites·33 claims
- 2183US7867828B2Method of fabricating a semiconductor device including forming an insulating layer with a hard sheet buried thereinCASIO COMPUTER CO LTD·Filed 2007·Granted Jan 11, 2011·10 cites·21 claims
- 2283US7727862B2Semiconductor device including semiconductor constituent and manufacturing method thereofCASIO COMPUTER CO LTD·Filed 2008·Granted Jun 1, 2010·7 cites·13 claims
- 2382US6888209B2Semiconductor package and method of fabricating the sameCASIO COMPUTER CO LTD·Filed 2003·Granted May 3, 2005·33 cites·12 claims
- 2482US6882054B2Semiconductor device and method of manufacturing the sameCASIO COMPUTER CO LTD·Filed 2003·Granted Apr 19, 2005·25 cites·10 claims
- 2575US7608480B2Method of fabricating a semiconductor device incorporating a semiconductor constructing body and an interconnecting layer which is connected to a ground layer via a vertical conducting portionCASIO COMPUTER CO LTD·Filed 2007·Granted Oct 27, 2009·4 cites·12 claims
- 2674US7582512B2Method of fabricating semiconductor device having conducting portion of upper and lower conductive layers on a peripheral surface of the semiconductor deviceCASIO COMPUTER CO LTD·Filed 2007·Granted Sep 1, 2009·5 cites·7 claims
- 2774US7368813B2Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereofCASIO COMPUTER CO LTD·Filed 2004·Granted May 6, 2008·14 cites·20 claims
- 2869US8063490B2Semiconductor device including semiconductor constituentJOBETTO HIROYASU·Filed 2010·Granted Nov 22, 2011·2 cites·15 claims
- 2968US7790515B2Semiconductor device with no base member and method of manufacturing the sameCASIO COMPUTER CO LTD·Filed 2007·Granted Sep 7, 2010·4 cites·17 claims
- 3068US7445964B2Semiconductor device and method of manufacturing the sameCASIO COMPUTER CO LTD·Filed 2006·Granted Nov 4, 2008·4 cites·29 claims
- 3166USRE41369ESemiconductor device and method of manufacturing the sameCASIO COMPUTER CO LTD·Filed 2007·Granted Jun 8, 2010·2 cites·27 claims
- 3261US7692282B2Semiconductor device including semiconductor element surrounded by an insulating member wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereofCASIO COMPUTER CO LTD·Filed 2007·Granted Apr 6, 2010·1 cites·21 claims
- 3359US7972903B2Semiconductor device having wiring line and manufacturing method thereofCASIO COMPUTER CO LTD·Filed 2009·Granted Jul 5, 2011·1 cites·10 claims
- 3459US7843071B2Semiconductor device including wiring and manufacturing method thereofCASIO COMPUTER CO LTD·Filed 2009·Granted Nov 30, 2010·1 cites·11 claims
- 3555US2009039514A1Semiconductor device and method for manufacturing the sameCASIO COMPUTER CO LTD·Filed 2008·Application pending·0 cites
- 3650US8268674B2Semiconductor device and method for manufacturing the sameJOBETTO HIROYASU·Filed 2010·Granted Sep 18, 2012·0 cites·15 claims
- 3750US7709942B2Semiconductor package, including connected upper and lower interconnectionsCASIO COMPUTER CO LTD·Filed 2004·Granted May 4, 2010·3 cites·41 claims
- 3846US2009039510A1Semiconductor device and manufacturing method thereofCASIO COMPUTER CO LTD·Filed 2008·Application pending·0 cites
- 3944US8237277B2Semiconductor device provided with tin diffusion inhibiting layer, and manufacturing method of the sameJOBETTO HIROYASU·Filed 2011·Granted Aug 7, 2012·0 cites·9 claims
- 4042US5635310AZnS dielectric thin film and magnetic recording mediumCASIO COMPUTER CO LTD·Filed 1994·Granted Jun 3, 1997·6 cites·18 claims
- 4138US2011001245A1Semiconductor device including sealing film for encapsulating semiconductor chip and projection electrodes and manufacturing method thereofCASIO COMPUTER CO LTD·Filed 2010·Application pending·0 cites
- 4238US2011001247A1Semiconductor device manufacturing methodCASIO COMPUTER CO LTD·Filed 2010·Application pending·0 cites
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