Inventor · disambiguated record
Kai Liu
Also filed as: LIU KAI · LIU KAI-YIN
151 granted patents·46 pending applications·655 citations·filing 2004–2025
99Inventor score
Files withREALTEK SEMICONDUCTOR CORP38QUALCOMM INC31ALPHA & OMEGA SEMICONDUCTOR23LIU KAI13STATS CHIPPAC LTD11
Top patents by PatentIndex Score
197 records- 0198US7629860B2Miniaturized wide-band baluns for RF applicationsSTATS CHIPPAC LTD·Filed 2007·Granted Dec 8, 2009·61 cites·31 claims
- 0297US9806040B2Antenna in embedded wafer-level ball-grid array packageSTATS CHIPPAC PTE LTD·Filed 2016·Granted Oct 31, 2017·19 cites·25 claims
- 0395US9368563B2Semiconductor device including integrated passive device formed over semiconductor die with conductive bridge and fan-out redistribution layerSTATS CHIPPAC LTD·Filed 2013·Granted Jun 14, 2016·19 cites·24 claims
- 0495US8513784B2Multi-layer lead frame package and method of fabricationLU JUN·Filed 2010·Granted Aug 20, 2013·24 cites·17 claims
- 0594US11994726B2Optical moduleHISENSE BROADBAND MULTIMEDIA TECHNOLOGY CO LTD·Filed 2022·Granted May 28, 2024·4 cites·20 claims
- 0694US10433425B1Three-dimensional high quality passive structure with conductive pillar technologyQUALCOMM INC·Filed 2018·Granted Oct 1, 2019·10 cites·16 claims
- 0794US10211171B2Antenna in embedded wafer-level ball-grid array packageSTATS CHIPPAC PTE LTD·Filed 2017·Granted Feb 19, 2019·10 cites·23 claims
- 0894US8581376B2Stacked dual chip package and method of fabricationYILMAZ HAMZA·Filed 2010·Granted Nov 12, 2013·22 cites·23 claims
- 0994US8354740B2Top-side cooled semiconductor package with stacked interconnection plates and methodALPHA & OMEGA SEMICONDUCTOR·Filed 2008·Granted Jan 15, 2013·27 cites·15 claims
- 1094US8154108B2Dual-leadframe multi-chip package and method of manufactureLIU KAI·Filed 2010·Granted Apr 10, 2012·15 cites·5 claims
- 1194US8062932B2Compact semiconductor package with integrated bypass capacitor and methodHEBERT FRANCOIS·Filed 2008·Granted Nov 22, 2011·30 cites·4 claims
- 1294US7622796B2Semiconductor package having a bridged plate interconnectionALPHA & OMEGA SEMICONDUCTOR·Filed 2007·Granted Nov 24, 2009·31 cites·23 claims
- 1393US8576026B2Semiconductor device having balanced band-pass filter implemented with LC resonatorLIU KAI·Filed 2008·Granted Nov 5, 2013·24 cites·30 claims
- 1493US8269575B2Semiconductor device and method of forming RF balun having reduced capacitive coupling and high CMRRFRYE ROBERT C·Filed 2010·Granted Sep 18, 2012·15 cites·25 claims
- 1593US7776658B2Compact co-packaged semiconductor dies with elevation-adaptive interconnection platesALPHA & OMEGA SEMICONDUCTOR·Filed 2008·Granted Aug 17, 2010·29 cites·16 claims
- 1692US10453774B1Thermally enhanced substrateQUALCOMM INC·Filed 2018·Granted Oct 22, 2019·8 cites·22 claims
- 1792US8624353B2Semiconductor device and method of forming integrated passive device over semiconductor die with conductive bridge and fan-out redistribution layerLIN YAOJIAN·Filed 2011·Granted Jan 7, 2014·13 cites·30 claims
- 1892US7683464B2Semiconductor package having dimpled plate interconnectionsALPHA & OMEGA SEMICONDUCTOR·Filed 2007·Granted Mar 23, 2010·25 cites·12 claims
- 1991US12235497B2Optical moduleHISENSE BROADBAND MULTIMEDIA TECHNOLOGY CO LTD·Filed 2024·Granted Feb 25, 2025·2 cites·20 claims
- 2091US11469101B2Semiconductor structure and manufacturing method thereforENKRIS SEMICONDUCTOR INC·Filed 2021·Granted Oct 11, 2022·2 cites·20 claims
- 2191US9685973B2Successive approximation register (SAR) analog-to-digital converting circuit and method thereofREALTEK SEMICONDUCTOR CORP·Filed 2016·Granted Jun 20, 2017·12 cites·8 claims
- 2288US10755418B2Background blurred method and electronic device based on foreground imageREALTEK SEMICONDUCTOR CORP·Filed 2019·Granted Aug 25, 2020·5 cites·18 claims
- 2388US9218987B2Method for top-side cooled semiconductor package with stacked interconnection platesALPHA & OMEGA SEMICONDUCTOR·Filed 2014·Granted Dec 22, 2015·7 cites·3 claims
- 2488US8111112B2Semiconductor device and method of forming compact coils for high performance filterLIU KAI·Filed 2010·Granted Feb 7, 2012·6 cites·24 claims
- 2587US8791775B2Semiconductor device and method of forming high-attenuation balanced band-pass filterLIU KAI·Filed 2010·Granted Jul 29, 2014·9 cites·32 claims
- 2686US11489539B1Analog-to-digital converter and method of operating sameREALTEK SEMICONDUCTOR CORP·Filed 2021·Granted Nov 1, 2022·2 cites·15 claims
- 2786US8680658B2Conductive clip for semiconductor device packageSHI LEI·Filed 2008·Granted Mar 25, 2014·14 cites·23 claims
- 2886US7511361B2DFN semiconductor package having reduced electrical resistanceZHANG XIAOTIAN·Filed 2005·Granted Mar 31, 2009·13 cites·8 claims
- 2985US12211923B2Semiconductor structure and forming method thereofENKRIS SEMICONDUCTOR INC·Filed 2021·Granted Jan 28, 2025·1 cites·20 claims
- 3085US11727537B1Bokeh effect in variable aperture (VA) camera systemsQUALCOMM INC·Filed 2022·Granted Aug 15, 2023·1 cites·30 claims
- 3184US11848205B2Semiconductor structure and manufacturing method thereforENKRIS SEMICONDUCTOR INC·Filed 2021·Granted Dec 19, 2023·1 cites·20 claims
- 3283US8564382B2Miniaturized wide-band baluns for RF applicationsLIU KAI·Filed 2009·Granted Oct 22, 2013·7 cites·25 claims
- 3383US8228154B2Miniaturized wide-band baluns for RF applicationsLIU KAI·Filed 2009·Granted Jul 24, 2012·8 cites·34 claims
- 3483US7892858B2Semiconductor package with stacked semiconductor die each having IPD and method of reducing mutual inductive coupling by providing selectable vertical and lateral separation between IPDSTATS CHIPPAC LTD·Filed 2008·Granted Feb 22, 2011·11 cites·21 claims
- 3583US7612439B2Semiconductor package having improved thermal performanceALPHA & OMEGA SEMICONDUCTOR·Filed 2005·Granted Nov 3, 2009·17 cites·12 claims
- 3682US11567522B2Voltage reference buffer circuitREALTEK SEMICONDUCTOR CORP·Filed 2021·Granted Jan 31, 2023·1 cites·8 claims
- 3782US8358179B2Semiconductor device and method of forming directional RF coupler with IPD for additional RF signal processingSTATS CHIPPAC LTD·Filed 2009·Granted Jan 22, 2013·8 cites·20 claims
- 3882US7884469B2Semiconductor package having a bridged plate interconnectionALPHA & OMEGA SEMICONDUCTOR·Filed 2009·Granted Feb 8, 2011·9 cites·17 claims
- 3981US8349648B2Semiconductor device and method of forming RF FEM with IC filter and IPD filter over substrateSTATS CHIPPAC LTD·Filed 2010·Granted Jan 8, 2013·6 cites·20 claims
- 4081US8035458B2Semiconductor device and method of integrating balun and RF coupler on a common substrateSTATS CHIPPAC LTD·Filed 2009·Granted Oct 11, 2011·8 cites·31 claims
- 4180US7811904B2Method of fabricating a semiconductor device employing electroless platingALPHA & OMEGA SEMICONDUCTOR·Filed 2007·Granted Oct 12, 2010·7 cites·9 claims
- 4280US7688160B2Compact coils for high performance filtersSTATS CHIPPAC LTD·Filed 2007·Granted Mar 30, 2010·7 cites·12 claims
- 4379US10943354B2Method and electronic apparatus for extracting foreground imageREALTEK SEMICONDUCTOR CORP·Filed 2019·Granted Mar 9, 2021·2 cites·16 claims
- 4479US10560703B2FLC-based image compression method and deviceREALTEK SEMICONDUCTOR CORP·Filed 2017·Granted Feb 11, 2020·2 cites·12 claims
- 4579US8981866B2Semiconductor device and method of forming RF balun having reduced capacitive coupling and high CMRRFRYE ROBERT C·Filed 2012·Granted Mar 17, 2015·4 cites·24 claims
- 4679US8390391B2Semiconductor device and method of integrating balun and RF coupler on a common substrateFRYE ROBERT C·Filed 2011·Granted Mar 5, 2013·4 cites·31 claims
- 4778US8951847B2Package leadframe for dual side assemblyKELKAR NIKHIL VISHWANATH·Filed 2012·Granted Feb 10, 2015·5 cites·11 claims
- 4878US8241952B2Semiconductor device and method of forming IPD in fan-out level chip scale packageLIN YAOJIAN·Filed 2010·Granted Aug 14, 2012·4 cites·19 claims
- 4977US11637559B2Method of operating analog-to-digital converter by reversed switching technique and analog-to-digital converter utilizing sameREALTEK SEMICONDUCTOR CORP·Filed 2021·Granted Apr 25, 2023·1 cites·16 claims
- 5077US2025219618A1Wideband filter with resonators and inductorsQUALCOMM INC·Filed 2025·Application pending·0 cites
Showing the top 50 of 197 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →