Inventor · disambiguated record
Hui-Lin Chang
Also filed as: CHANG HUI-LIN
26 granted patents·9 pending applications·155 citations·filing 2003–2021
95Inventor score
Files withTAIWAN SEMICONDUCTOR MFG19CHANG HUI-LIN6T MOBILE INNOVATIONS LLC3YU CHEN-HUA3SPRINT COMMUNICATIONS CO LP1
Top patents by PatentIndex Score
35 records- 0192US8053356B2Interconnect structure for semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Nov 8, 2011·9 cites·19 claims
- 0291US7312531B2Semiconductor device and fabrication method thereofTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Dec 25, 2007·22 cites·32 claims
- 0389US11844134B1Cell site repair part prediction machine learning systemSPRINT COMMUNICATIONS CO LP·Filed 2020·Granted Dec 12, 2023·4 cites·20 claims
- 0488US10051506B1Traffic management in wireless networksSPRINT SPECTRUM LP·Filed 2015·Granted Aug 14, 2018·12 cites·20 claims
- 0585US7655556B2Interconnect structures for semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Feb 2, 2010·6 cites·10 claims
- 0683US8158521B2Two step post-deposition treatment of ILD layer for a lower dielectric constant and improved mechanical propertiesCHANG HUI-LIN·Filed 2007·Granted Apr 17, 2012·9 cites·23 claims
- 0782US8143162B2Interconnect structure having a silicide/germanide cap layerYU CHEN-HUA·Filed 2009·Granted Mar 27, 2012·9 cites·20 claims
- 0880US7094705B2Multi-step plasma treatment method to improve CU interconnect electrical performanceTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Aug 22, 2006·28 cites·22 claims
- 0978US7642189B2Synergy effect of alloying materials in interconnect structuresTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Jan 5, 2010·6 cites·21 claims
- 1077US7250370B2Two step post-deposition treatment of ILD layer for a lower dielectric constant and improved mechanical propertiesTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Jul 31, 2007·19 cites·11 claims
- 1175US7834458B2Interconnect structure for semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Nov 16, 2010·2 cites·17 claims
- 1271US8987085B2Methods for improving uniformity of cap layersYU CHEN-HUA·Filed 2006·Granted Mar 24, 2015·3 cites·19 claims
- 1367US7977791B2Selective formation of boron-containing metal cap pre-layerTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Jul 12, 2011·3 cites·20 claims
- 1467US7897505B2Method for enhancing adhesion between layers in BEOL fabricationTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Mar 1, 2011·2 cites·6 claims
- 1567US7129164B2Method for forming a multi-layer low-K dual damasceneTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Oct 31, 2006·11 cites·35 claims
- 1663US9385034B2Carbonization of metal capsCHANG HUI-LIN·Filed 2007·Granted Jul 5, 2016·3 cites·20 claims
- 1762US8999842B2Interconnect structure for semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Apr 7, 2015·0 cites·20 claims
- 1860US9219036B2Interconnect structure for semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Dec 22, 2015·0 cites·20 claims
- 1958US8785324B2Interconnect structure for semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Jul 22, 2014·0 cites·17 claims
- 2056US8330275B2Interconnect structure for semiconductor devicesCHANG HUI-LIN·Filed 2011·Granted Dec 11, 2012·0 cites·19 claims
- 2155US12356220B2Telecommunications network predictions based on machine learning using aggregated network key performance indicatorsT MOBILE INNOVATIONS LLC·Filed 2021·Granted Jul 8, 2025·0 cites·20 claims
- 2254US8264046B2Synergy effect of alloying materials in interconnect structuresCHANG HUI-LIN·Filed 2009·Granted Sep 11, 2012·0 cites·10 claims
- 2354US7352053B2Insulating layer having decreased dielectric constant and increased hardnessTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Apr 1, 2008·4 cites·20 claims
- 2449US7456093B2Method for improving a semiconductor device delamination resistanceTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Nov 25, 2008·3 cites·33 claims
- 2548US2007228571A1Interconnect structure having a silicide/germanide cap layerYU CHEN-HUA·Filed 2006·Application pending·0 cites
- 2646US7629273B2Method for modulating stresses of a contact etch stop layerTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Dec 8, 2009·0 cites·9 claims
- 2745US2010090342A1Metal Line Formation Through Silicon/Germanium SoakingCHANG HUI-LIN·Filed 2008·Application pending·0 cites
- 2844US2008197461A1Apparatus for wire bonding and integrated circuit chip packageTAIWAN SEMICONDUCTOR MFG·Filed 2007·Application pending·0 cites
- 2942US11848843B2Network anomaly detection using machine learning modelsT MOBILE INNOVATIONS LLC·Filed 2021·Granted Dec 19, 2023·0 cites·20 claims
- 3041US2007205507A1Carbon and nitrogen based cap materials for metal hard mask schemeCHANG HUI-LIN·Filed 2006·Application pending·0 cites
- 3141US2006226549A1Semiconductor device and fabricating method thereofTAIWAN SEMICONDUCTOR MFG·Filed 2005·Application pending·0 cites
- 3239US2005048795A1Method for ultra low-K dielectric depositionFiled 2003·Application pending·0 cites
- 3339US2023206060A1Seasonal component adjustment in network anomaly detectionT MOBILE INNOVATIONS LLC·Filed 2021·Application pending·0 cites
- 3438US2010295173A1Composite Underfill and Semiconductor PackageTAIWAN SEMICONDUCTOR MFG·Filed 2010·Application pending·0 cites
- 3535US2004142560A1Method of selective growth of carbon nano-structures on silicon substratesFiled 2003·Application pending·0 cites
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