Inventor · disambiguated record
Robert W. Berner
Also filed as: BERNER ROBERT W
30 granted patents·4 pending applications·1,477 citations·filing 1994–2005
98Inventor score
Top patents by PatentIndex Score
34 records- 0197US6627051B2Cathode current control system for a wafer electroplating apparatusSEMITOOL INC·Filed 2001·Granted Sep 30, 2003·57 cites·7 claims
- 0295US6440178B2Modular semiconductor workpiece processing toolSEMITOOL INC·Filed 2001·Granted Aug 27, 2002·82 cites·12 claims
- 0395US6203582B1Modular semiconductor workpiece processing toolSEMITOOL INC·Filed 1996·Granted Mar 20, 2001·154 cites·14 claims
- 0494US6004440ACathode current control system for a wafer electroplating apparatusSEMITOOL INC·Filed 1997·Granted Dec 21, 1999·117 cites·25 claims
- 0592US6322674B1Cathode current control system for a wafer electroplating apparatusSEMITOOL INC·Filed 1999·Granted Nov 27, 2001·62 cites·8 claims
- 0692US6139703ACathode current control system for a wafer electroplating apparatusSEMITOOL INC·Filed 1999·Granted Oct 31, 2000·67 cites·28 claims
- 0792US5678320ASemiconductor processing systemsSEMITOOL INC·Filed 1995·Granted Oct 21, 1997·87 cites·45 claims
- 0892US5544421ASemiconductor wafer processing systemSEMITOOL INC·Filed 1994·Granted Aug 13, 1996·107 cites·38 claims
- 0991US5731678AProcessing head for semiconductor processing machinesSEMITOOL INC·Filed 1996·Granted Mar 24, 1998·120 cites·32 claims
- 1091US5660517ASemiconductor processing system with wafer container docking and loading stationSEMITOOL INC·Filed 1995·Granted Aug 26, 1997·84 cites·10 claims
- 1189US6843894B2Cathode current control system for a wafer electroplating apparatusSEMITOOL INC·Filed 2003·Granted Jan 18, 2005·24 cites·35 claims
- 1285US5954911ASemiconductor processing using vapor mixturesSEMITOOL INC·Filed 1996·Granted Sep 21, 1999·57 cites·71 claims
- 1383US6014817ASemiconductor wafer processing systemSEMITOOL INC·Filed 1999·Granted Jan 18, 2000·43 cites·15 claims
- 1482US6120641AProcess architecture and manufacturing tool sets employing hard mask patterning for use in the manufacture of one or more metallization levels on a workpieceSEMITOOL INC·Filed 1998·Granted Sep 19, 2000·67 cites·47 claims
- 1575US5784797ACarrierless centrifugal semiconductor processing systemSEMITOOL INC·Filed 1996·Granted Jul 28, 1998·51 cites·64 claims
- 1674US6162734ASemiconductor processing using vapor mixturesSEMITOOL INC·Filed 1999·Granted Dec 19, 2000·32 cites·23 claims
- 1771US6833035B1Semiconductor processing system with wafer container docking and loading stationSEMITOOL INC·Filed 2000·Granted Dec 21, 2004·12 cites·9 claims
- 1870US5996241ASemiconductor wafer processing system with immersion moduleSEMITOOL INC·Filed 1997·Granted Dec 7, 1999·24 cites·20 claims
- 1969US6001234AMethods for plating semiconductor workpieces using a workpiece-engaging electrode assembly with sealing bootSEMITOOL INC·Filed 1997·Granted Dec 14, 1999·30 cites·2 claims
- 2069US5882168ASemiconductor processing systemsSEMITOOL INC·Filed 1997·Granted Mar 16, 1999·32 cites·22 claims
- 2168US6960257B2Semiconductor processing system with wafer container docking and loading stationSEMITOOL INC·Filed 2003·Granted Nov 1, 2005·10 cites·24 claims
- 2267US7074246B2Modular semiconductor workpiece processing toolSEMITOOL INC·Filed 2002·Granted Jul 11, 2006·8 cites·12 claims
- 2366US7087143B1Plating system for semiconductor materialsSEMITOOL INC·Filed 1996·Granted Aug 8, 2006·33 cites·19 claims
- 2466US5836736ASemiconductor processing system with wafer container docking and loading stationSEMITOOL INC·Filed 1996·Granted Nov 17, 1998·32 cites·22 claims
- 2565US6319841B1Semiconductor processing using vapor mixturesSEMITOOL INC·Filed 2000·Granted Nov 20, 2001·16 cites·19 claims
- 2665US5784802ASemiconductor processing systemsSEMITOOL INC·Filed 1997·Granted Jul 28, 1998·25 cites·26 claims
- 2764US5788454ASemiconductor wafer processing systemSEMITOOL INC·Filed 1996·Granted Aug 4, 1998·19 cites·28 claims
- 2856US6454926B1Semiconductor plating system workpiece support having workpiece-engaging electrode with submerged conductive current transfer areasSEMITOOL INC·Filed 1997·Granted Sep 24, 2002·10 cites·44 claims
- 2950US2005193537A1Modular semiconductor workpiece processing toolFiled 2005·Application pending·0 cites
- 3048US6461494B1Methods for plating semiconductor workpieces using a workpiece-engaging electrode assembly with sealing bootSEMITOOL INC·Filed 1999·Granted Oct 8, 2002·11 cites·5 claims
- 3148US2003029732A1Semiconductor plating system workpiece support having workpiece-engaging electrode with submerged conductive current transfer areasFiled 2002·Application pending·0 cites
- 3247US2005230260A1Plating apparatus and methodSURFECT TECHNOLOGIES INC·Filed 2005·Application pending·0 cites
- 3341US2004035707A1Methods for plating semiconductor workpieces using a workpiece-engaging electrode assembly with sealing bootFiled 2003·Application pending·0 cites
- 3433US6805778B1Contact assembly for supplying power to workpieces during electrochemical processingSEMITOOL INC·Filed 1999·Granted Oct 19, 2004·4 cites·3 claims
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