Inventor · disambiguated record
Naoto Miyashita
Also filed as: MIYASHITA NAOTO
40 granted patents·12 pending applications·1,465 citations·filing 1988–2025
98Inventor score
Top patents by PatentIndex Score
52 records- 0196US5643046APolishing method and apparatus for detecting a polishing end point of a semiconductor waferTOSHIBA KK·Filed 1995·Granted Jul 1, 1997·207 cites·9 claims
- 0292US7351131B2Method for manufacturing semiconductor device and polishing apparatusTOSHIBA KK·Filed 2005·Granted Apr 1, 2008·20 cites·7 claims
- 0392US5643406AChemical-mechanical polishing (CMP) method for controlling polishing rate using ionized water, and CMP apparatusTOSHIBA KK·Filed 1996·Granted Jul 1, 1997·115 cites·26 claims
- 0491US6933234B2Method for manufacturing semiconductor device and polishing apparatusTOSHIBA KK·Filed 2002·Granted Aug 23, 2005·50 cites·16 claims
- 0591US5605488APolishing apparatus of semiconductor waferTOSHIBA KK·Filed 1994·Granted Feb 25, 1997·192 cites·12 claims
- 0689US6167583B1Double side cleaning apparatus for semiconductor substrateTOSHIBA KK·Filed 1998·Granted Jan 2, 2001·101 cites·24 claims
- 0782US7005382B2Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing process, production process of semiconductor device and material for preparing an aqueous dispersion for chemical mechanical polishingTOSHIBA KK·Filed 2003·Granted Feb 28, 2006·30 cites·8 claims
- 0882US2025388024A1Liquid container and inkjet recording device including sameKYOCERA DOCUMENT SOLUTIONS INC·Filed 2025·Application pending·0 cites
- 0981US2025388016A1Liquid container and inkjet recording device including sameKYOCERA DOCUMENT SOLUTIONS INC·Filed 2025·Application pending·0 cites
- 1081US2025388017A1Liquid container and inkjet recording device including sameKYOCERA DOCUMENT SOLUTIONS INC·Filed 2025·Application pending·0 cites
- 1181US2025388023A1Liquid container and inkjet recording device including sameKYOCERA DOCUMENT SOLUTIONS INC·Filed 2025·Application pending·0 cites
- 1281US2025388020A1Liquid container and inkjet recording device including sameKYOCERA DOCUMENT SOLUTIONS INC·Filed 2025·Application pending·0 cites
- 1381US2025388018A1Liquid container and inkjet recording device including sameKYOCERA DOCUMENT SOLUTIONS INC·Filed 2025·Application pending·0 cites
- 1480US5922620AChemical-mechanical polishing (CMP) method for controlling polishing rate using ionized water, and CMP apparatusTOSHIBA KK·Filed 1997·Granted Jul 13, 1999·51 cites·16 claims
- 1580US2025388019A1Liquid container and inkjet recording device including sameKYOCERA DOCUMENT SOLUTIONS INC·Filed 2025·Application pending·0 cites
- 1679US6468911B1Method of chemical/mechanical polishing of the surface of semiconductor deviceTOSHIBA KK·Filed 2000·Granted Oct 22, 2002·19 cites·20 claims
- 1776US7246079B2Method of predicting initial input of new product, system for predicting initial input of new product, and recording mediumFUJITSU LTD·Filed 2001·Granted Jul 17, 2007·11 cites·14 claims
- 1874US6667238B1Polishing method and apparatusEBARA CORP·Filed 2000·Granted Dec 23, 2003·15 cites·13 claims
- 1973US6354913B1Abrasive and method for polishing semiconductor substrateTOSHIBA KK·Filed 1998·Granted Mar 12, 2002·42 cites·16 claims
- 2073US5968239APolishing slurryTOSHIBA KK·Filed 1998·Granted Oct 19, 1999·40 cites·17 claims
- 2172US5993639AMethod for producing electrolytic ionic water and an apparatus for the sameTOSHIBA KK·Filed 1997·Granted Nov 30, 1999·36 cites·30 claims
- 2272US5861054APolishing slurryTOSHIBA KK·Filed 1996·Granted Jan 19, 1999·40 cites·15 claims
- 2371US5029554ASemiconductor manufacturing apparatus including a temperature control mechanismTOSHIBA KK·Filed 1989·Granted Jul 9, 1991·37 cites·7 claims
- 2469US6007696AApparatus and method for manufacturing electrolytic ionic water and washing method using electroyltic ionic waterTOSHIBA KK·Filed 1997·Granted Dec 28, 1999·33 cites·39 claims
- 2568US6241581B1Method for dressing a polishing pad, polishing apparatus, and method for manufacturing a semiconductor apparatusTOSHIBA KK·Filed 1998·Granted Jun 5, 2001·30 cites·6 claims
- 2667US6723226B1Method and apparatus for forming electrolytic water and apparatus for washing semiconductor substrate using electrolytic water-forming apparatusTOSHIBA KK·Filed 1996·Granted Apr 20, 2004·33 cites·8 claims
- 2766US5434447ASemiconductor device having a trench for device isolation and method of fabricating the sameTOSHIBA KK·Filed 1994·Granted Jul 18, 1995·30 cites·5 claims
- 2866US4916086AMethod of manufacturing a semiconductor device having rounded trench cornersTOSHIBA KK·Filed 1988·Granted Apr 10, 1990·32 cites·5 claims
- 2964US5943578AMethod of manufacturing a semiconductor device having an element isolating regionTOSHIBA KK·Filed 1997·Granted Aug 24, 1999·25 cites·15 claims
- 3063US5880032AMethod and apparatus for manufacturing a semiconductor deviceTOSHIBA KK·Filed 1996·Granted Mar 9, 1999·28 cites·15 claims
- 3162US7101259B2Polishing method and apparatusTOSHIBA KK·Filed 2003·Granted Sep 5, 2006·7 cites·15 claims
- 3261US5346555ADevice for thermal treatment and film forming processTOSHIBA KK·Filed 1993·Granted Sep 13, 1994·32 cites·6 claims
- 3360US6045605AAbrasive material for polishing a semiconductor wafer, and methods for manufacturing and using the abrasive materialTOSHIBA KK·Filed 1998·Granted Apr 4, 2000·16 cites·17 claims
- 3460US2025065620A1Inkjet recording apparatusKYOCERA DOCUMENT SOLUTIONS INC·Filed 2024·Application pending·0 cites
- 3559US6867138B2Method of chemical/mechanical polishing of the surface of semiconductor deviceTOSHIBA KK·Filed 2002·Granted Mar 15, 2005·5 cites·10 claims
- 3658US6716087B2Method for dressing a polishing pad, polishing apparatus, and method for manufacturing a semiconductor apparatusTOSHIBA KK·Filed 2001·Granted Apr 6, 2004·5 cites·4 claims
- 3757US5589421AMethod of manufacturing annealed filmsTOSHIBA KK·Filed 1994·Granted Dec 31, 1996·27 cites·6 claims
- 3857US2024408865A1Ink-jet recording apparatusKYOCERA DOCUMENT SOLUTIONS INC·Filed 2024·Application pending·0 cites
- 3956US5878191AHeat treatment apparatus for semiconductor wafersTOSHIBA KK·Filed 1995·Granted Mar 2, 1999·22 cites·62 claims
- 4055US6069083APolishing method, semiconductor device fabrication method, and semiconductor fabrication apparatusTOSHIBA KK·Filed 1996·Granted May 30, 2000·19 cites·7 claims
- 4154US6001238AMethod for purifying pure water and an apparatus for the sameTOSHIBA KK·Filed 1997·Granted Dec 14, 1999·18 cites·21 claims
- 4254US5858859ASemiconductor device having a trench for device isolation fabrication methodTOSHIBA KK·Filed 1997·Granted Jan 12, 1999·14 cites·1 claims
- 4354US5683908AMethod of fabricating trench isolation structure having tapered openingTOSHIBA KK·Filed 1996·Granted Nov 4, 1997·14 cites·4 claims
- 4452US6098638AMethod of manufacturing a semiconductor device and an apparatus for manufacturing the sameTOSHIBA KK·Filed 1996·Granted Aug 8, 2000·18 cites·12 claims
- 4550US2025183076A1Wafer container and wafer supportMURATA MACHINERY LTD·Filed 2023·Application pending·0 cites
- 4648US5332683AMethod of manufacturing semiconductor device having elements isolated by trenchTOSHIBA KK·Filed 1993·Granted Jul 26, 1994·17 cites·3 claims
- 4746US5380399AMethod of treating semiconductor substratesTOSHIBA KK·Filed 1993·Granted Jan 10, 1995·15 cites·30 claims
- 4846US2015255317A1Semiconductor manufacturing equipment and manufacturing method of semiconductor deviceTOSHIBA KK·Filed 2014·Application pending·0 cites
- 4945US6783658B2Electropolishing methodTOSHIBA KK·Filed 2002·Granted Aug 31, 2004·2 cites·18 claims
- 5043USRE36328ESemiconductor manufacturing apparatus including temperature control mechanismTOSHIBA KK·Filed 1997·Granted Oct 5, 1999·10 cites·8 claims
Showing the top 50 of 52 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →